Substrate processing method
US-2024379370-A1 · Nov 14, 2024 · US
by rotary tools, e.g. drills {(B28D5/0005 takes precedence)}
by rotary tools, e.g. drills {(B28D5/0005 takes precedence)} · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B28D5/02 |
| Official title | by rotary tools, e.g. drills {(B28D5/0005 takes precedence)} |
| Display label | by rotary tools, e.g. drills {(B28D5/0005 takes precedence)} |
| Total patents | 65 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 1 |
| 2017 | 5 |
| 2018 | 2 |
| 2019 | 5 |
| 2020 | 4 |
| 2021 | 12 |
| 2022 | 12 |
| 2023 | 9 |
| 2024 | 6 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate processing apparatus and substrate processing method
US-12142483-B2 · Nov 12, 2024 · US
Cutting machine
US-12121975-B2 · Oct 22, 2024 · US
Singulation of silicon carbide semiconductor wafers
US-2024234155-A1 · Jul 11, 2024 · US
Singulation of silicon carbide semiconductor wafers
US-11942327-B2 · Mar 26, 2024 · US
Processing apparatus
US-11890711-B2 · Feb 6, 2024 · US
Method of grinding workpiece
US-11813717-B2 · Nov 14, 2023 · US
Wafer trimming device
US-11705323-B2 · Jul 18, 2023 · US
Cutting apparatus
US-11654520-B2 · May 23, 2023 · US
Processing apparatus
US-11654509-B2 · May 23, 2023 · US
Semiconductor structure and method for manufacturing preparing same
US-2023154869-A1 · May 18, 2023 · US
Method of producing microrods for electron emitters, and associated microrods and electron emitters
US-11651924-B1 · May 16, 2023 · US
Method for manufacturing a monocrystalline sapphire seed as well as a sapphire single-crystal with a preferred crystallographic orientation and external part and functional components for watchmaking and jewellery
US-2023133632-A1 · May 4, 2023 · US
Processing apparatus
US-11633872-B2 · Apr 25, 2023 · US
Systems and methods for forming semiconductor cutting/trimming blades
US-11565371-B2 · Jan 31, 2023 · US
Wafer processing apparatus
US-2022415674-A1 · Dec 29, 2022 · US
Cutting apparatus
US-11518057-B2 · Dec 6, 2022 · US
Method of processing wafer
US-11482408-B2 · Oct 25, 2022 · US
Processing apparatus
US-2022308549-A1 · Sep 29, 2022 · US
Singulation of silicon carbide semiconductor wafers
US-2022238343-A1 · Jul 28, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B28D5/02?
- CPC B28D5/02 is the Cooperative Patent Classification code for “by rotary tools, e.g. drills {(B28D5/0005 takes precedence)}.”
- How many patents are filed under CPC B28D5/02 (by rotary tools, e.g. drills {(B28D5/0005 takes precedence)})?
- Our database includes 65 publications tagged with this CPC code.
- Is patent activity under CPC B28D5/02 growing?
- Publication counts under this code: 6 in 2024 vs 5 in 2025 (latest complete years).