Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-12142483-B2
Application number	US-201917295480-A
Country	US
Kind code	B2
Filing date	Nov 11, 2019
Priority date	Nov 21, 2018
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

A substrate processing apparatus configured to process a substrate includes a substrate holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate; a periphery removing unit configured to remove, starting from a periphery modification layer formed on the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate, the peripheral portion from the combined substrate held by the substrate holder; and a collection unit equipped with a collection mechanism configured to collect the peripheral portion removed by the periphery removing unit.

First claim

We claim:

1. A substrate processing apparatus configured to process a substrate, comprising:
a substrate holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate;
a laser head configured to form a periphery modification layer in the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate by radiating a laser beam into the first substrate;
an insertion member having a shape in which a width of the insertion member decreases diametrically outwards when viewed from a side and configured to rotate about a vertical axis, and configured to be inserted between the first substrate and the second substrate and remove, starting from the periphery modification layer formed in the first substrate, the peripheral portion from the combined substrate held by the substrate holder; and
a collection unit equipped with a collection tray configured to collect the peripheral portion removed by the insertion member.

2. The substrate processing apparatus of claim 1 , wherein the collection unit is equipped with a weight measurement device configured to measure a weight of the collection tray.

3. The substrate processing apparatus of claim 1 , wherein the collection unit is equipped with a crushing roller configured to crush the peripheral portion collected from the insertion member by the collection tray.

4. The substrate processing apparatus of claim 1 , wherein the collection unit is equipped with a buffer tray configured to accommodate the peripheral portion collected from the insertion member by the collection tray.

5. The substrate processing apparatus of claim 1 , wherein the collection unit is equipped with a discharge mechanism configured to discharge particles generated when the peripheral portion is removed, and wherein the discharge mechanism includes: a cover body, in which the insertion member is provided, configured to receive the particles; and a discharge duct configured to discharge the particles from the cover body.

6. The substrate processing apparatus of claim 5 , wherein the collection tray is connected to the discharge duct, and the collection tray is configured to collect the peripheral portion, which is removed by the insertion member and received by the cover body, and the particles received by the cover body.

7. The substrate processing apparatus of claim 1 , wherein the collection tray includes multiple collection trays allowed to be replaced.

8. The substrate processing apparatus of claim 1 , wherein the insertion member removes the peripheral portion by applying an impact to the peripheral portion.

9. The substrate processing apparatus of claim 8 , wherein the insertion member is a roller.

10. The substrate processing apparatus of claim 8 , further comprising: a rotating mechanism configured to rotate the substrate holder; and a pressing roller configured to press the peripheral portion, which is peeled from the second substrate by the insertion member, in a direction toward the second substrate.

11. The substrate processing apparatus of claim 1 , wherein a distance between an outer end portion of the combined substrate and the insertion member is allowed to be adjusted.

12. The substrate processing apparatus of claim 1 , wherein the insertion member is equipped with a buffer tray configured to absorb an impact caused when inserted into an interface between the first substrate and the second substrate.

13. The substrate processing apparatus of claim 8 , further comprising: a rotating mechanism configured to rotate the substrate holder, wherein the insertion member removes the peripheral portion by applying an impact to the peripheral portion while the first substrate is rotated by the rotating mechanism.

14. The substrate processing apparatus of claim 1 , wherein the substrate holder holds the combined substrate in a state where an in-plane direction of the combined substrate is set to a vertical direction.

15. The substrate processing apparatus of claim 1 , further comprising: a sensor configured to detect presence or absence of the peripheral portion in the first substrate which is held by the substrate holder and from which the peripheral portion is removed by the insertion member.

16. The substrate processing apparatus of claim 1 , further comprising: a fluid supply configured to supply a fluid to the first substrate in the combined substrate held by the substrate holder.

17. The substrate processing apparatus of claim 1 , further comprising: an ionizer configured to suppress electrostatic charging when the peripheral portion is removed.

18. A substrate processing method of processing a substrate, comprising:
holding, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate by a substrate holder;
forming a periphery modification layer in the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate by radiating a laser beam into the first substrate;
removing, starting from the periphery modification layer, the peripheral portion from the combined substrate held by the substrate holder by an insertion member having a shape in which a width of the insertion member decreases diametrically outwards when viewed from a side and configured to rotate about a vertical axis, and configured to be inserted between the first substrate and the second substrate; and
collecting the peripheral portion removed by the insertion member.

19. The substrate processing method of claim 18 , wherein particles generated in the removing of the peripheral portion are guided to a discharge duct by a cover body having therein the insertion member configured to remove the peripheral portion, and then, discharged from a discharge mechanism through the discharge duct.

Assignees

• Tokyo Electron Ltd

Inventors

• Kawaguchi Yoshihiro
• Nakano Seiji
• Kodama Munehisa
• Mori Hirotoshi
• Tanoue Hayato
• Yamawaki Yohei

Classifications

• H10P72/70

  for supporting or gripping · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• Y02W30/62

  Plastics recycling; Rubber recycling · CPC title