Mount flange
US-9833922-B2 · Dec 5, 2017 · US
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor (working by grinding or polishing B24; for artistic purposes B44B)
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor (working by grinding or polishing B24; for artistic purposes B44B) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B28D5/00 |
| Official title | Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor (working by grinding or polishing B24; for artistic purposes B44B) |
| Display label | Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor (working by grinding or polishing B24; for artistic purposes B44B) |
| Total patents | 240 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 30 |
| 2017 | 27 |
| 2018 | 17 |
| 2019 | 24 |
| 2020 | 18 |
| 2021 | 28 |
| 2022 | 25 |
| 2023 | 16 |
| 2024 | 17 |
| 2025 | 17 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate dividing method
US-2017271210-A1 · Sep 21, 2017 · US
Wafer processing method
US-9716039-B2 · Jul 25, 2017 · US
Systems and methods for scintillators having micro-crack surfaces
US-9709684-B2 · Jul 18, 2017 · US
Wafer processing apparatus
US-9679789-B2 · Jun 13, 2017 · US
Large aluminum nitride crystals with reduced defects and methods of making them
US-9598791-B2 · Mar 21, 2017 · US
Process for producing group iii nitride crystal and apparatus for producing group iii nitride crystal
US-2017073840-A1 · Mar 16, 2017 · US
Wafer processing method
US-2017069537-A1 · Mar 9, 2017 · US
Large diameter, high quality SiC single crystals, method and apparatus
US-RE46315-E · Feb 21, 2017 · US
Method of cutting super-hard materials using an electron beam and a range of beam scanning velocities
US-9555499-B2 · Jan 31, 2017 · US
Wafer thinning method
US-2017025275-A1 · Jan 26, 2017 · US
Wafer thinning method
US-2017025276-A1 · Jan 26, 2017 · US
Substrate dividing method
US-9548246-B2 · Jan 17, 2017 · US
Substrate dividing method
US-9543207-B2 · Jan 10, 2017 · US
Method for transferring a layer from a single-crystal substrate
US-2016351438-A1 · Dec 1, 2016 · US
Wafer processing method
US-2016343614-A1 · Nov 24, 2016 · US
Substrate dividing method
US-2016343619-A1 · Nov 24, 2016 · US
Substrate dividing method
US-2016343618-A1 · Nov 24, 2016 · US
Substrate dividing method
US-2016343674-A1 · Nov 24, 2016 · US
Substrate dividing method
US-2016343617-A1 · Nov 24, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B28D5/00?
- CPC B28D5/00 is the Cooperative Patent Classification code for “Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor (working by grinding or polishing B24; for artistic purposes B44B).”
- How many patents are filed under CPC B28D5/00 (Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor (working by grinding or polishing B24; for artistic purposes B44B))?
- Our database includes 240 publications tagged with this CPC code.
- Is patent activity under CPC B28D5/00 growing?
- Publication counts under this code: 17 in 2024 vs 17 in 2025 (latest complete years).