Systems and methods for scintillators having micro-crack surfaces

Patent metadata

Field	Value
Publication number	US-9709684-B2
Application number	US-201414570040-A
Country	US
Kind code	B2
Filing date	Dec 15, 2014
Priority date	Dec 15, 2014
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A scintillator crystal array that is configured to receive rays emitted by an object to be imaged and to emit light energy responsive to the received rays includes plural crystals. At least one of the crystals includes an upper surface, a lower surface disposed opposite the upper surface, plural sides extending between the upper surface and the lower surface, and a micro-crack surface extending at least partially along at least one of the sides. The micro-crack surface includes micro-cracks formed in the crystal configured for controlling distribution of light through the crystal.

First claim

What is claimed is:

1. A scintillator crystal array configured to receive rays emitted by an object to be imaged and to emit light energy responsive to the received rays, the scintillator crystal array comprising plural crystals, at least one of the crystals comprising:
an upper surface;
a lower surface disposed opposite the upper surface;
plural sides extending between the upper surface and the lower surface; and
a micro-crack surface extending at least partially along at least one of the sides, the micro-crack surface comprising micro-cracks formed in the crystal configured for controlling distribution of light through the crystal, the micro-crack surface at least partially disposed on an exterior of the crystal that is immediately adjacent to a neighboring crystal of the scintillator crystal array, the micro-crack surface configured to control light spread from the crystal to the neighboring crystal.

2. The scintillator crystal array of claim 1 , wherein a depth is defined extending from the upper surface to the lower surface, and wherein a width of the micro-crack surface varies along the depth.

3. The scintillator crystal array of claim 1 , wherein the micro-crack surface is disposed on the at least one of the sides.

4. The scintillator crystal array of claim 1 , wherein the micro-crack surface comprises a planar surface disposed on an interior of the crystal.

5. The scintillator crystal array of claim 1 , wherein the micro-crack surface comprises plural planar surfaces disposed on an interior of the crystal.

6. The scintillator crystal array of claim 1 , wherein the micro-crack surface comprises a first planar surface disposed on the at least one of the sides and at least one planar surface disposed on an interior of the crystal.

7. The scintillator crystal array of claim 1 , wherein the micro-crack surface is a planar surface that is not parallel to the at least one of the sides along which the micro-crack surface extends.

8. The scintillator crystal array of claim 1 , wherein the plural sides define a polygonal cross-section, wherein the at least one side along which the micro-crack surface extends comprises a single side.

9. The scintillator crystal array of claim 1 , further comprising a reflector disposed around the sides of the scintillator crystal array surrounding the sides of the scintillator crystal array but not separating individual crystals of the crystal array, the reflector configured to reflect light directed from the sides of the scintillator crystal array back into the scintillator crystal array.

10. A detector system for imaging an object comprising:
a scintillator block configured to receive rays from an object to be imaged and to emit light energy responsive to the received rays, the scintillator block including a scintillator crystal array comprising plural crystals, at least one of the crystals comprising:
an upper surface;
a lower surface disposed opposite the upper surface;
plural sides extending between the upper surface and the lower surface; and
a micro-crack surface extending at least partially along at least one of the sides, the micro-crack surface comprising micro-cracks formed in the crystal configured for controlling distribution of light through the crystal, the micro-crack surface at least partially disposed on an exterior of the crystal that is immediately adjacent to a neighboring crystal of the scintillator crystal array, the micro-crack surface configured to control light spread from the crystal to the neighboring crystal; and
at least one photosensor configured to receive the light energy emitted from the scintillator crystal array.

11. The system of claim 10 , wherein at least some crystals at least one of directly contact an adjacent crystal or are separated by adjacent crystals by only an airgap.

12. The detector system of claim 10 , wherein the at least one photosensor comprises two photosensors, wherein the scintillator block is interposed between the photosensors, and the sides are configured to extend perpendicularly to a gamma ray source.

13. The detector system of claim 10 , wherein the upper surface is configured to be oriented toward a gamma ray source and the lower surface is oriented toward the photosensor.

14. The detector system of claim 10 , wherein a depth is defined extending from the upper surface to the lower surface, and wherein a width of the micro-crack surface varies along the depth.

15. The detector system of claim 10 , wherein the micro-crack surface is disposed on the at least one of the sides.

16. The detector system of claim 10 , wherein the micro-crack surface is a planar surface disposed on an interior of the crystal.

17. A method for providing a scintillator for imaging an object, the method comprising:
providing at least one crystal comprising:
an upper surface;
a lower surface disposed opposite the upper surface;
plural sides extending between the upper surface and the lower surface; and
a micro-crack surface extending at least partially along at least one of the sides, the micro-crack surface comprising micro-cracks formed in the crystal configured for controlling distribution of light through the crystal, the micro-crack surface at least partially disposed on an exterior of the crystal that is immediately adjacent to a neighboring crystal of the scintillator crystal array, the micro-crack surface configured to control light spread from the crystal to the neighboring crystal;
assembling the at least one crystal with plural additional crystals to form a scintillator crystal array; and
providing a reflector disposed around the sides of the scintillator crystal array, the reflector disposed around the sides of the crystal array surrounding the sides of the crystal array but not separating individual crystals of the array, the reflector configured to reflect light directed from the sides of the scintillator crystal array back into the scintillator crystal array.

18. The method of claim 17 , wherein the scintillator crystal array is joined with other scintillator crystal arrays to form the scintillator block.

19. The method of claim 17 , wherein the scintillator crystal array comprises plural crystals having corresponding micro-crack surfaces, and wherein assembling the at least one crystal with the plural additional crystals to form the scintillator crystal array includes orienting the micro-crack surfaces toward an interior of the scintillator crystal array.

20. The method of claim 17 , wherein the scintillator crystal array comprises plural crystals having corresponding micro-crack surfaces, and wherein assembling the at least one crystal with the plural additional crystals to form the scintillator crystal array includes positioning the micro-crack surface of each crystal adjacent to and oriented toward a corresponding micro-crack surface of an adjacent crystal.

21. The method of claim 17 , wherein providing the crystal includes'
saw cutting the crystal from a block of crystal material;
polishing the sides; and
applying laser energy to form the micro-crack surface.

Assignees

• Gen Electric

Inventors

• Kim Chang Lyong

Classifications

• G01T1/2002 Primary

  Optical details, e.g. reflecting or diffusing layers · CPC title

• B23K26/0066

  Operations & Transport · mapped topic

• G01T1/2006

  using a combination of a scintillator and photodetector which measures the means radiation intensity · CPC title

• G01T1/2985

  In depth localisation, e.g. using positron emitters; Tomographic imaging (longitudinal and transverse section imaging; apparatus for radiation diagnosis sequentially in different planes, steroscopic radiation diagnosis); (using external radiation sources A61B6/02) · CPC title

• G01T1/202 Primary

  the detector being a crystal · CPC title