Wafer processing apparatus

Patent metadata

Field	Value
Publication number	US-9679789-B2
Application number	US-201414556881-A
Country	US
Kind code	B2
Filing date	Dec 1, 2014
Priority date	Dec 9, 2013
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

A wafer in which a modified layer is internally formed along planned dividing lines is placed on a placement table and a water tank allows the wafer placed on the placement table to be submerged in cleaning water. An ultrasonic supply unit supplies ultrasonic waves to the wafer submerged in the cleaning water. By the ultrasonic waves supplied by the ultrasonic supply unit, the wafer is divided along the planned dividing lines and is turned into small pieces to generate plural chips and the generated chips are cleaned.

First claim

What is claimed is:

1. A wafer processing apparatus to divide a wafer, comprising:
a placement table on which the wafer is placed, a modified layer having been formed inside the wafer by irradiating the wafer with pulsed laser beam having such a wavelength as to be transmitted through the wafer along planned dividing lines, with a light focus point positioned inside the wafer;
a water tank for submerging the wafer placed on the placement table in cleaning water; and
an ultrasonic supply means that supplies ultrasonic waves to the wafer submerged in the cleaning water,
wherein the ultrasonic supply means includes an ultrasonic oscillator that is disposed in contact with a water surface in the water tank above the placement table, and ultrasonic waves generated by the ultrasonic oscillator are supplied to the wafer from an upper surface side,
a variator that changes frequency and output power of the ultrasonic waves generated by the ultrasonic oscillator,
wherein the variator sets frequency and output power of the ultrasonic waves generated by the ultrasonic oscillator in cleaning of the chips to frequency and output power different from frequency and output power of the ultrasonic waves generated by the ultrasonic oscillator in dividing of the wafer, and
wherein by the ultrasonic waves supplied by the ultrasonic supply means, the wafer is divided along the planned dividing lines and is turned into small pieces to generate a plurality of chips and the generated chips are cleaned.

2. The wafer processing apparatus according to claim 1 ,
wherein the placement table has a through-hole vertically penetrating a placement surface on which the wafer is placed,
the ultrasonic supply means has an ultrasonic oscillator disposed separately from the placement surface of the placement table below the placement surface, and
ultrasonic waves generated by the ultrasonic oscillator pass through the through-hole to be supplied to the wafer from a lower surface side.

3. A wafer processing apparatus to divide a wafer, comprising:
a placement table on which the wafer is placed, a modified layer having been formed inside the wafer by irradiating the wafer with pulsed laser beam having such a wavelength as to be transmitted through the wafer along planned dividing lines, with a light focus point positioned inside the wafer;
a water tank for submerging the wafer placed on the placement table in cleaning water; and
an ultrasonic supply means including
a first ultrasonic oscillator disposed separately from the placement surface of the placement table below the placement surface, and
a second ultrasonic oscillator disposed in contact with a water surface in the water tank above the placement table,
a variator that changes frequency and output power of the ultrasonic waves generated by the ultrasonic oscillator,
wherein the placement table has a through-hole vertically penetrating a placement surface on which the wafer is placed, and ultrasonic waves generated by the first ultrasonic oscillator pass through the through-hole to be supplied to the wafer from a lower surface side and ultrasonic waves generated by the second ultrasonic oscillator are supplied to the wafer from an upper surface side,
wherein the variator sets frequency and output power of the ultrasonic waves generated by the ultrasonic oscillator in cleaning of the chips to frequency and output power different from frequency and output power of the ultrasonic waves generated by the ultrasonic oscillator in dividing of the wafer; and
wherein by the ultrasonic waves supplied by the ultrasonic supply means, the wafer is divided along the planned dividing lines and is turned into small pieces to generate a plurality of chips and the generated chips are cleaned.

Assignees

• Disco Corp

Inventors

• Obata Tsukuru

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P70/30

  Cleaning after the substrates have been singulated · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/0416 Primary

  with the semiconductor substrates being dipped in baths or vessels · CPC title