Cutting apparatus
US-9314853-B2 · Apr 19, 2016 · US
Mount flange
US9833922B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9833922-B2 |
| Application number | US-201614993420-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 12, 2016 |
| Priority date | Jan 16, 2015 |
| Publication date | Dec 5, 2017 |
| Grant date | Dec 5, 2017 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A mount flange for mounting a cutting blade on a spindle is provided. The cutting blade has a central engaging hole and a peripheral cutting edge. The mount flange includes a cylindrical boss portion having a front portion adapted to be inserted into the engaging hole of the cutting blade and a rear portion whose inner circumferential surface is adapted to be engaged with the spindle, and a flange portion projecting radially outward from the rear portion of the boss portion and having a front surface functioning as a mounting surface adapted to come into abutment against one side surface of the cutting blade. An annular space is formed in the mount flange so as to surround the spindle and open to the inner circumferential surface of the boss portion, thereby suppressing rearward warpage of the outer circumference of the flange portion due to the rotation of the spindle.
First claim
Opening claim text (preview).
What is claimed is: 1. A mount flange for mounting a cutting blade on a spindle, said cutting blade having a central engaging hole and a peripheral cutting edge, said mount flange comprising: a cylindrical boss portion having a front portion adapted to be inserted into said engaging hole of said cutting blade and a rear portion whose inner circumferential surface is adapted to be engaged with said spindle; and a flange portion projecting radially outward from said rear portion of said boss portion and having a front surface functioning as a mounting surface adapted to come into abutment against one side surface of said cutting blade; wherein an annular space is formed in said mount flange at the rear portion of the cylindrical boss portion so as to surround said spindle, said annular space being enclosed on a side by a rear-most portion of the cylindrical boss portion, the annular space being open to the inner circumferential surface of said boss portion, thereby suppressing rearward warpage of an outer circumference of said flange portion due to the rotation of said spindle. 2. The mount flange according to claim 1 , wherein a first suction passage is formed in said spindle, and a second suction passage is formed in said mount flange so as to be open to said front surface of said flange portion, said second suction passage being connected to said first suction passage when said mount flange is fixed to said spindle.
Assignees
Inventors
Classifications
Cutting or separating of wafers, substrates or parts of devices · CPC title
- H10P52/00Primary
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
Vacuum · CPC title
- B26D7/2621Primary
for circular cutters · CPC title
Vacuum chucks · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9833922B2 cover?
- A mount flange for mounting a cutting blade on a spindle is provided. The cutting blade has a central engaging hole and a peripheral cutting edge. The mount flange includes a cylindrical boss portion having a front portion adapted to be inserted into the engaging hole of the cutting blade and a rear portion whose inner circumferential surface is adapted to be engaged with the spindle, and a fla…
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P52/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).