Heat chamfering apparatus and method
US-2024190753-A1 · Jun 13, 2024 · US
by thermic methods
by thermic methods · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B28D1/221 |
| Official title | {by thermic methods} |
| Display label | by thermic methods |
| Total patents | 84 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 7 |
| 2017 | 8 |
| 2018 | 15 |
| 2019 | 9 |
| 2020 | 8 |
| 2021 | 9 |
| 2022 | 5 |
| 2023 | 5 |
| 2024 | 7 |
| 2025 | 2 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Methods of separating a glass web
US-2021230043-A1 · Jul 29, 2021 · US
Wafer processing method and wafer processing apparatus
US-2021233814-A1 · Jul 29, 2021 · US
Method for forming a crack in an edge region of a donor substrate
US-2021213643-A1 · Jul 15, 2021 · US
Methods of separating a glass web
US-11008244-B2 · May 18, 2021 · US
Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam
US-10994442-B2 · May 4, 2021 · US
Method of determining whether or not result of processing process of laser processing apparatus is acceptable
US-2021060697-A1 · Mar 4, 2021 · US
Method for the material-saving production of wafers and processing of wafers
US-10843380-B2 · Nov 24, 2020 · US
Method for guiding a crack in the peripheral region of a donor substrate
US-10676386-B2 · Jun 9, 2020 · US
Pulsed laser method for machining a diamond
US-2020122268-A1 · Apr 23, 2020 · US
Laser working method, laser working apparatus, and its manufacturing method
US-10622254-B2 · Apr 14, 2020 · US
Method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material and cut brittle material
US-10576651-B2 · Mar 3, 2020 · US
Wafer producing method
US-10563321-B2 · Feb 18, 2020 · US
A Method of Machining Brittle Materials
US-2020039109-A1 · Feb 6, 2020 · US
Method for Separating Thin Layers of Solid Material from a Solid Body
US-2020006119-A1 · Jan 2, 2020 · US
Tube glass cutting method and cutting device, and tube glass product manufacturing method
US-10508052-B2 · Dec 17, 2019 · US
System and method for shaping a ceramic matrix composite (CMC) sheet
US-10376985-B2 · Aug 13, 2019 · US
Method for guiding a crack in the peripheral region of a donor substrate
US-2019218131-A1 · Jul 18, 2019 · US
Water producing method
US-10297438-B2 · May 21, 2019 · US
Method for guiding a crack in the peripheral region of a donor substrate
US-10280107-B2 · May 7, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B28D1/221?
- CPC B28D1/221 is the Cooperative Patent Classification code for “by thermic methods.”
- How many patents are filed under CPC B28D1/221 (by thermic methods)?
- Our database includes 84 publications tagged with this CPC code.
- Is patent activity under CPC B28D1/221 growing?
- Publication counts under this code: 7 in 2024 vs 2 in 2025 (latest complete years).