Laser working method, laser working apparatus, and its manufacturing method

Patent metadata

Field	Value
Publication number	US-10622254-B2
Application number	US-201615213723-A
Country	US
Kind code	B2
Filing date	Jul 19, 2016
Priority date	Aug 3, 2007
Publication date	Apr 14, 2020
Grant date	Apr 14, 2020

Abstract

An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.

First claim

The invention claimed is:

1. A functional element chip forming method comprising the steps of:
irradiating a plate-shaped substrate to be processed with a laser light;
locating a converging point of the laser light within the substrate forming a functional element on its surface so as to form a modified region serving as a starting point for cutting along a line to cut the substrate, and that forms a functional element chip by cutting the substrate along the line to be cut, wherein
a reflection spatial light modulator, which modulates the laser light, a converging optical system, which converges the laser light modulated by the reflection spatial light modulator inside the substrate, and an adjustment optical system, which has a first optical element and a second optical element functioning as lenses that are located on an optical path between the reflection spatial light modulator and the converging optical system, are provided; and
disposing the first optical element and the second optical element so as to match a wavefront form at the reflection spatial light modulator to a wavefront form at the converging optical system, and so that the first optical element and the second optical element form a double telecentric optical system, wherein
at the time of forming the modified region, the laser light is modulated by a reflection spatial light modulator such that aberration of the laser light occurs at a position on which a converging point of the laser light is located inside the substrate becomes a predetermined aberration or less.

2. A functional element chip forming method including the steps of:
irradiating a plate-shaped substrate to be processed with a laser light;
locating a converging point of the laser light within the substrate forming a functional element on its surface so as to form a modified region serving as a starting point for cutting along a line to cut the substrate, and that forms a functional element chip by cutting the substrate along the line to be cut, wherein
a reflection spatial light modulator, which modulates the laser light, a converging optical system, which converges the laser light modulated by the reflection spatial light modulator inside the substrate, and an adjustment optical system, which has a first optical element and a second optical element functioning as lenses that are located on an optical path between the reflection spatial light modulator and the converging optical system, are provided; and
disposing the first optical element and the second optical element so as to match a wavefront form at the reflection spatial light modulator to a wavefront form at the converging optical system, and so that the first optical element and the second optical element form a double telecentric optical system, wherein
at the time of forming the modified region, the laser light is modulated by a reflection spatial light modulator such that a wavefront of the laser light becomes a predetermined wavefront inside the substrate.

3. The functional element chip forming method according to claim 1 , wherein
the first optical element and second optical element are disposed such that a distance between the reflection spatial light modulator and the first optical element becomes the first focal distance of the first optical element, a distance between the converging optical system and the second optical element becomes the second focal distance of the second optical element, and a distance between the first optical element the second optical element becomes the sum of the first focal distance and the second focal distance,
which forms modified regions in a plurality of lines so as to line up in the thickness direction of the substrate along the line to cut of the substrate, wherein at the time of forming the modified regions in one line or a plurality of lines including a modified region farthest from a laser light entrance surface of the substrate among the modified regions in a plurality of lines, modifies the distance between the convergence optical system and the substrate so that the distance between the convergence optical system that converges the laser light inside the substrate and the substrate becomes a predetermined distance, in accordance with the modified region to be formed.

4. The functional element chip forming method according to claim 2 , wherein
the first optical element and second optical element are disposed such that a distance between the reflection spatial light modulator and the first optical element becomes the first focal distance of the first optical element, a distance between the converging optical system and the second optical element becomes the second focal distance of the second optical element, and a distance between the first optical element the second optical element becomes the sum of the first focal distance and the second focal distance,
which forms modified regions in a plurality of lines so as to line up in the thickness direction of the substrate along the line to cut of the substrate, wherein at the time of forming the modified regions in one line or a plurality of lines including a modified region farthest from a laser light entrance surface of the substrate among the modified regions in a plurality of lines, modifies the distance between the convergence optical system and the substrate so that the distance between the convergence optical system that converges the laser light inside the substrate and the substrate becomes a predetermined distance, in accordance with the modified region to be formed.

5. The functional element chip forming method according to claim 3 , wherein
in the case in which the plurality of lines are set with respect to the substrate, the modified regions are formed in a plurality of lines along another one of the lines after forming the modified regions in a plurality of lines along one of the lines.

6. The functional element chip forming method according to claim 4 , wherein
in the case in which the plurality of lines are set with respect to the substrate, the modified regions are formed in a plurality of lines along another one of the lines after forming the modified regions and a plurality of lines along one of the lines.

7. The functional element chip forming method according to claim 3 , wherein
in the case in which the plurality of lines are set with respect to the substrate, the modified regions are formed in another one line along the plurality of lines after forming the modified regions in one line along the plurality of lines.

8. The functional element chip forming method according to claim 4 , wherein
in the case in which the plurality of lines are set with respect to the substrate, the modified regions are formed in another one line along the plurality of lines after forming the modified regions in one line along the plurality of lines.

9. The functional element chip forming method according to claim 1 , wherein the substrate is a semiconductor substrate or a sapphire.

10. The functional element chip forming method according to claim 2 , wherein the substrate is a semiconductor substrate or a sapphire.

11. The functional element chip forming method according to claim 3 , wherein the substrate is a semiconductor substrate or a sapphire.

12. The functional element chip forming method according to claim 4 , wherein the substrate is a semiconductor substrate or a sapphire.

13. The functional element chip forming method according to claim 7 , wherein the substrate is a semiconductor substrate or a sapphire.

14. The functional element chip forming method according to claim 6 , wherein the substrate is a semiconductor substrate or a sapp

Assignees

• Hamamatsu Photonics Kk

Inventors

• Nakano Makoto
• Kuno Koji
• Osajima Tetsuya
• Inoue Takashi
• Kumagai Masayoshi

Classifications

• C03B33/0222

  Scoring using a focussed radiation beam, e.g. laser · CPC title

• B23K26/128

  Laser beam path enclosures · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title

• B23K26/38

  by boring or cutting · CPC title

• B23K2101/40

  Semiconductor devices · CPC title