Polishing measurement device and abrasion time controlling method thereof, and polishing control system including same
US-2021205948-A1 · Jul 8, 2021 · US
characterised by the shape of the lapping plate surface, e.g. grooved
characterised by the shape of the lapping plate surface, e.g. grooved · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B37/16 |
| Official title | characterised by the shape of the lapping plate surface, e.g. grooved |
| Display label | characterised by the shape of the lapping plate surface, e.g. grooved |
| Total patents | 105 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 5 |
| 2017 | 10 |
| 2018 | 11 |
| 2019 | 11 |
| 2020 | 17 |
| 2021 | 6 |
| 2022 | 8 |
| 2023 | 16 |
| 2024 | 10 |
| 2025 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Debris-removal groove for CMP polishing pad
US-10875146-B2 · Dec 29, 2020 · US
Planarization apparatus and planarization method thereof
US-10879077-B2 · Dec 29, 2020 · US
Method for polishing substrate including functional chip
US-2020391341-A1 · Dec 17, 2020 · US
Abrasive articles with precisely shaped features and method of making thereof
US-2020298370-A1 · Sep 24, 2020 · US
Surface plate cleaning apparatus
US-10780548-B2 · Sep 22, 2020 · US
Dressing device, polishing apparatus, holder, housing and dressing method
US-10777417-B2 · Sep 15, 2020 · US
Dummy disk, dressing disk, and surface height measurement method using dummy disk
US-2020246936-A1 · Aug 6, 2020 · US
Wafer polishing pad and using method thereof
US-10722998-B2 · Jul 28, 2020 · US
Abrasive articles with precisely shaped features and method of making thereof
US-10710211-B2 · Jul 14, 2020 · US
Dressing device, polishing apparatus, holder, housing and dressing method
US-2020219728-A1 · Jul 9, 2020 · US
Method for machining a workpiece in the production of an optical element
US-2020198086-A1 · Jun 25, 2020 · US
Microreplicated polishing surface with enhanced co-planarity
US-2020164484-A1 · May 28, 2020 · US
Single bodied platen housing a detection module for cmp systems
US-2020164481-A1 · May 28, 2020 · US
One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
US-10654146-B2 · May 19, 2020 · US
Method for producing substrate
US-10646976-B2 · May 12, 2020 · US
Dressing device, polishing apparatus, holder, housing and dressing method
US-10636665-B2 · Apr 28, 2020 · US
Systems and methods for suction pad assemblies
US-2020043814-A1 · Feb 6, 2020 · US
Pad conditioner with spacer and wafer planarization system
US-2019337119-A1 · Nov 7, 2019 · US
Polishing apparatus and substrate processing apparatus
US-2019299360-A1 · Oct 3, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B37/16?
- CPC B24B37/16 is the Cooperative Patent Classification code for “characterised by the shape of the lapping plate surface, e.g. grooved.”
- How many patents are filed under CPC B24B37/16 (characterised by the shape of the lapping plate surface, e.g. grooved)?
- Our database includes 105 publications tagged with this CPC code.
- Is patent activity under CPC B24B37/16 growing?
- Publication counts under this code: 10 in 2024 vs 5 in 2025 (latest complete years).