Dressing device, polishing apparatus, holder, housing and dressing method

Patent metadata

Field	Value
Publication number	US-10777417-B2
Application number	US-202016822411-A
Country	US
Kind code	B2
Filing date	Mar 18, 2020
Priority date	Aug 12, 2016
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

A dressing device including: a disk that has an opening on an inside, the disk dressing a polishing surface for polishing a substrate; a rotatable holder, the disk being coupled to a lower surface side of the holder, the holder being provided with a first flow passage that passes from a lower surface to an upper surface, the lower surface being inside an outer edge of the opening of the disk; and a housing that is provided with a distance from the upper surface of the holder, the housing being provided with a second flow passage in an interior, the housing being fixed such that an opening of the second flow passage faces the upper surface of the holder, the second flow passage being connected with a supply source and a suction source of process liquid.

First claim

What is claimed is:

1. A dressing method that is executed by a dressing device,
the dressing device comprising:
a disk that has an opening on an inside, the disk dressing a polishing surface for polishing a substrate;
a rotatable holder, the disk being coupled to a lower surface side of the holder, the holder being provided with a first flow passage that passes from a lower surface to an upper surface, the lower surface being inside an outer edge of the opening of the disk; and
a housing that is provided with a distance from the upper surface of the holder, the housing being provided with a second flow passage in an interior, the housing being fixed such that one end of the second flow passage faces the upper surface of the holder,
the dressing method comprising:
a first supplying pure water to the polishing surface, through the second flow passage and the first flow passage in order, during dressing; and
a first sucking process liquid on the polishing surface, through the first flow passage and the second flow passage in order, during the dressing.

2. The dressing method according to claim 1 , further comprising:
a second supplying polishing liquid to the polishing surface, through the second flow passage and the first flow passage in order, during polishing by a polishing head; and
a second sucking the process liquid on the polishing surface, through the first flow passage and the second flow passage in order, during supply of washing water by an atomizer.

Assignees

• Ebara Corp

Inventors

• Shinozaki Hiroyuki

Classifications

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B37/04 Primary

  designed for working plane surfaces · CPC title

• B24B53/017

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B37/16

  characterised by the shape of the lapping plate surface, e.g. grooved · CPC title

• B24B37/10

  for single side lapping · CPC title