Method for slicing workpiece and wire saw
US-10518380-B2 · Dec 31, 2019 · US
using a cutting wire
using a cutting wire · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B27/0633 |
| Official title | {using a cutting wire} |
| Display label | using a cutting wire |
| Total patents | 94 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 16 |
| 2017 | 11 |
| 2018 | 14 |
| 2019 | 9 |
| 2020 | 8 |
| 2021 | 7 |
| 2022 | 4 |
| 2023 | 4 |
| 2024 | 6 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Silicon carbide ingot and method for manufacturing silicon carbide substrate
US-10427324-B2 · Oct 1, 2019 · US
Metal wire, saw wire, cutting apparatus, and method of manufacturing metal wire
US-2019232404-A1 · Aug 1, 2019 · US
Method for slicing workpiece and workpiece holder
US-10350788-B2 · Jul 16, 2019 · US
Wire guide roll for wire saw and method
US-10245661-B2 · Apr 2, 2019 · US
Abrasive article and method of forming
US-2019091782-A1 · Mar 28, 2019 · US
Method for slicing workpiece and processing liquid
US-10189181-B2 · Jan 29, 2019 · US
Saw wire and cutting apparatus
US-2018326517-A1 · Nov 15, 2018 · US
Saw wire and cutting apparatus
US-2018326519-A1 · Nov 15, 2018 · US
Semiconductor wafer processing method
US-2018297168-A1 · Oct 18, 2018 · US
Method for slicing workpiece and wire saw
US-2018281147-A1 · Oct 4, 2018 · US
Abrasive diamond grain for wire tool and wire tool
US-2018215074-A1 · Aug 2, 2018 · US
Machining methods of forming laminated glass structures
US-10029941-B2 · Jul 24, 2018 · US
Method for slicing workpiece
US-10029392-B2 · Jul 24, 2018 · US
Electronic Component Removal Device
US-2018206371-A1 · Jul 19, 2018 · US
Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece
US-10011046-B2 · Jul 3, 2018 · US
Method for manufacturing hexagonal semiconductor plate crystal
US-2018079109-A1 · Mar 22, 2018 · US
Wire saw apparatus
US-2018079108-A1 · Mar 22, 2018 · US
Polyalkylene glycol-grafted polycarboxylate suspension and dispersing agent for cutting fluids and slurries
US-9920273-B2 · Mar 20, 2018 · US
Method for processing semiconductor wafer
US-9881783-B2 · Jan 30, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B27/0633?
- CPC B24B27/0633 is the Cooperative Patent Classification code for “using a cutting wire.”
- How many patents are filed under CPC B24B27/0633 (using a cutting wire)?
- Our database includes 94 publications tagged with this CPC code.
- Is patent activity under CPC B24B27/0633 growing?
- Publication counts under this code: 6 in 2024 vs 3 in 2025 (latest complete years).