Polyalkylene glycol-grafted polycarboxylate suspension and dispersing agent for cutting fluids and slurries

Patent metadata

Field	Value
Publication number	US-9920273-B2
Application number	US-201514942178-A
Country	US
Kind code	B2
Filing date	Nov 16, 2015
Priority date	Oct 16, 2009
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent:
A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water.

These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.

First claim

What is claimed is:

1. A cutting slurry comprising in weight percent:
A. 25-90% PAG having a molecular weight of 100-1,000;
B. 0.004-5% PAG-g-polycarboxylate comprising a polycarboxylate structure and polyalkylene oxide units covalently bonded to the polycarboxylate structure, wherein the polycarboxylate structure comprises units derived from acrylic acid, maleic acid or methacrylicacid and the weight percent of total polyalkylene oxide units in the PAG-g-polycarboxylate is at least 40%;
C. 0-15% water; and
D. 25-75% abrasive material, wherein the abrasive material includes diamond, silica, tungsten carbide, silicon carbide, boron carbide, silicon nitride, aluminum oxide or combinations thereof.

2. The cutting slurry of claim 1 in which the polycarboxylate structure has a molecular weight of 1,000 to 10,000.

3. The cutting slurry of claim 2 in which the weight percent of total polyalkylene oxide units in the PAG-g-polycarboxylate is at least 60%.

4. The cutting slurry of claim 3 wherein the cutting slurry has a pH of 5-8.

5. The cutting slurry of claim 4 further comprising wherein the weight percent of the PAG is 25-67%, wherein the weigh percent of the PAG g-polycarboxylate is 0.004-5%, wherein the weight percent of the water is 0-15%, and wherein the weight percent of the abrasive material is 25-70%.

6. The cutting slurry of claim 1 , wherein the weight percent of the PAG is 25-75%.

7. The cutting slurry of claim 1 , wherein the weight percent of the PAG is 70-90%.

8. A method of cutting a brittle material with a cutting wire, the method comprising the step of applying abrasive slurry to the wire as the brittle material is brought into contact with the wire, the abrasive slurry comprising:
A. 25-75% PAG having a molecular weight of 100-1,000;
B. 0.004-5% PAG-g-polycarboxylate comprising a polycarboxylate structure and polyalkylene oxide units covalently bonded to the polycarboxylate structure, wherein the polycarboxylate structure comprises units derived from acrylic acid, maleic acid or methacrylic acid and the weight percent of total polyalkylene oxide units in the PAG-g-polycarboxylate is at least 40%;
C. 0-15% water; and
D. 25-75% abrasive material.

9. The method of claim 8 in which the polycarboxylate structure has a molecular weight of 1,000-10,000.

10. The method of claim 9 in which the weight percent of total polyalkylene oxide units in the PAG-g-polycarboxylate is at least 60%.

11. The method of claim 10 wherein the abrasive slurry has a pH of 5-8.

12. The method of claim 10 wherein the abrasive slurry has a PH of 7-8.

Assignees

• Dow Global Technologies Llc

Inventors

• Zhu yi-ping
• Yu Wanglin
• Li Fang
• Aguilar Daniel A
• Wurm Brad

Classifications

• C10M169/044

  the additives being a mixture of non-macromolecular and macromolecular compounds · CPC title

• C10M2201/10

  Compounds containing silicon · CPC title

• C10M2209/086

  polycarboxylic, e.g. maleic acid · CPC title

• C10N2030/04

  Detergent property or dispersant property · CPC title

• B24B27/0633

  using a cutting wire · CPC title