Flux and solder paste
US-12479051-B2 · Nov 25, 2025 · US
Halogen compounds
Halogen compounds · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/3616 |
| Official title | {Halogen compounds} |
| Display label | Halogen compounds |
| Total patents | 37 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 4 |
| 2017 | 6 |
| 2018 | 3 |
| 2019 | 3 |
| 2020 | 3 |
| 2021 | 5 |
| 2022 | 2 |
| 2023 | 2 |
| 2024 | 5 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flux and solder paste
US-2025256362-A1 · Aug 14, 2025 · US
Flux, resin flux cored solder using the flux, and soldering method
US-12172243-B2 · Dec 24, 2024 · US
Brazing material, brazing member, heat exchanger, and producing method of brazing member
US-12103115-B2 · Oct 1, 2024 · US
Flux for resin-cored solder, resin-cored solder, and soldering method
US-12017307-B2 · Jun 25, 2024 · US
Flux for Resin-Cored Solder, Resin-Cored Solder, and Soldering Method
US-2024033863-A1 · Feb 1, 2024 · US
Solder alloy composition, its preparation method and uses in room-temperature rapid solid-state soldering
US-2024009777-A1 · Jan 11, 2024 · US
Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device
US-11819955-B2 · Nov 21, 2023 · US
Liquid metal paste containing metal particle additive
US-2023197558-A1 · Jun 22, 2023 · US
Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ecu electronic circuit, on-board electronic circuit device, and ecu electronic circuit device
US-2022250194-A1 · Aug 11, 2022 · US
Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux
US-11292089-B2 · Apr 5, 2022 · US
Flux for solder paste and solder paste
US-11167380-B2 · Nov 9, 2021 · US
Flux for solder paste and solder paste
US-2021213569-A1 · Jul 15, 2021 · US
Flux, Resin Flux Cored Solder Using the Flux, and Soldering Method
US-2021197323-A1 · Jul 1, 2021 · US
Brazing material, brazing member, heat exchanger, and producing method of brazing member
US-2021187672-A1 · Jun 24, 2021 · US
Solder composition, electronic board, and bonding method
US-10913132-B2 · Feb 9, 2021 · US
Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux
US-2020391329-A1 · Dec 17, 2020 · US
Flux and solder paste
US-10843298-B2 · Nov 24, 2020 · US
Flux composition for solder applications
US-10610979-B2 · Apr 7, 2020 · US
Flux and solder paste
US-2019366487-A1 · Dec 5, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/3616?
- CPC B23K35/3616 is the Cooperative Patent Classification code for “Halogen compounds.”
- How many patents are filed under CPC B23K35/3616 (Halogen compounds)?
- Our database includes 37 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/3616 growing?
- Publication counts under this code: 5 in 2024 vs 2 in 2025 (latest complete years).