Flux
US-2019030656-A1 · Jan 31, 2019 · US
Flux for solder paste and solder paste
US11167380B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11167380-B2 |
| Application number | US-201917059435-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 28, 2019 |
| Priority date | Jun 1, 2018 |
| Publication date | Nov 9, 2021 |
| Grant date | Nov 9, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass %. The flux also contains 0-20 mass % of a block organic acid and 0-3 mass % of an activator.
First claim
Opening claim text (preview).
The invention claimed is: 1. A flux for a solder paste comprising: rosin; an imidazole compound; and a solvent, wherein 25% by mass or more and 35% by mass or less of the imidazole compound with respect to 100% by mass of the flux is included. 2. The flux for a solder paste according to claim 1 , wherein 15% by mass or more and 40% by mass or less of the rosin, and 15% by mass or more and 35% by mass or less of the solvent with respect to 100% by mass of the flux are included. 3. The flux for a solder paste according to claim 1 or 2 , further comprising: 0% by mass or more and 20% by mass or less of a block organic acid with respect to 100% by mass of the flux. 4. The flux for a solder paste according to any one of claims 1 to 3 , further comprising: 0% by mass or more and 3% by mass or less of an activator with respect to 100% by mass of the flux. 5. The flux for a solder paste according to any one of claims 1 to 4 , further comprising: 0% by mass or more and 10% by mass or less of a thixotropic agent with respect to 100% by mass of the flux. 6. The flux for a solder paste according to any one of claims 1 to 5 , further comprising: 0% by mass or more and 5% by mass or less of an antifoaming agent with respect to 100% by mass of the flux. 7. The flux for a solder paste according to any one of claims 1 to 6 , further comprising: 0% by mass or more and 5% by mass or less of an antioxidant with respect to 100% by mass of the flux. 8. A solder paste comprising: the flux for a solder paste according to claim 1 ; and a metal powder.
Assignees
Inventors
Classifications
Pastes, creams or slurries · CPC title
Alloys based on tin · CPC title
- B23K35/26Primary
with the principal constituent melting at less than 400°C · CPC title
- B23K35/362Primary
Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title
Sn as the principal constituent · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11167380B2 cover?
- Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass %. The flux also contains 0-20 mass % of a block organic acid and 0-3 mass % of an activator.
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/26. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).