Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux

Patent metadata

Field	Value
Publication number	US-11292089-B2
Application number	US-201916960002-A
Country	US
Kind code	B2
Filing date	Jan 15, 2019
Priority date	Jan 17, 2018
Publication date	Apr 5, 2022
Grant date	Apr 5, 2022

Abstract

A resin composition for soldiering is provided. The resin composition includes 1 wt % or more and 40 wt % or less of a dimer acid, a trimer acid, or a combination thereof, 30 wt % or more and 99 wt % or less of a rosin, and 0 wt % or more and 13 wt % or less of a solvent. The dimer acid is selected from a dimer acid that is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid that is a reaction product of oleic acid and linoleic acid, and a combination thereof. The trimer acid is selected from a trimer acid that is a reaction product of oleic acid and linoleic acid, a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid that is a reaction product of oleic acid and linoleic acid, and a combination thereof.

First claim

The invention claimed is:

1. A flux for soldering consisting of:
a total amount of 1 wt % or more and 40 wt % or less of a dimer acid, a trimer acid, or a combination thereof;
30 wt % or more and 99 wt % or less of a rosin;
0 wt % or more and 13 wt % or less of a solvent;
0 wt % or more and 4 wt % or less of an organic acid;
0 wt % or more and 2 wt % or less of an amine;
0 wt % or more and 5 wt % or less of an organic halogen compound;
0 wt % or more and 1 wt % or less of an amine hydrohalide salt;
0 wt % or more and 3 wt % or less of an antifoaming agent;
0 wt % or more and 5 wt % or less of a silicone oil;
0 wt % or more and 10 wt % or less of an organophosphorus compound; and
0 wt % or more and 40 wt % or less of an additional resin,
wherein the dimer acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reaction product of oleic acid and linoleic acid, and a combination thereof,
the trimer acid is selected from a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction product of oleic acid and linoleic acid, and a combination thereof,
the additional resin is selected from the group consisting of: a terpene resin, a modified terpene resin, a terpene phenol resin, a modified terpene phenolic resin, a xylene resin, a modified xylene resin, polyvinyl acetate, polyvinyl alcohol, polyethylene polyvinyl acetate copolymer, and combinations thereof, and
the solvent is selected from the group consisting of: water, butyl stearate, 2-ethylhexyl stearate, isotridecyl stearate, methyl oleate, isobutyl oleate, coconut fatty acid methyl, methyl laurate, isopropyl myristate, isopropyl palmitate, 2-ethylhexyl palmitate, octyldodecyl myristate, ethanol, mixed solvent obtained by adding methanol and/or isopropyl alcohol to ethanol, isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1,5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3-dimethyl-2,3-butanediol, 1,1,1-tris(hydroxymethyl)ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2′-oxybis(methylene)bis(2-ethyl-1,3-propanediol), 2,2-bis(hydroxymethyl)-1,3-propanediol, 1,2,6-trihydroxyhexane, bis[2,2,2-tris(hydroxymethyl)ethyl]ether, 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, erythritol, threitol, guaiacol glycerol ether, 3,6-dimethyl-4-octyne-3,6-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol, hexyldiglycol, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether, and combinations thereof.

2. A resin flux cored solder, wherein
a linear solder is filled with the flux for soldering according to claim 1 .

3. A flux coated solder, wherein
a solder is coated with the flux for soldering according to claim 1 .

Assignees

• Senju Metal Industry Co

Inventors

• ONITSUKA Motohiro
• Kurasawa Yoko
• Kawasaki Hiroyoshi

Classifications

• B23K35/3613 Primary

  Polymers, e.g. resins · CPC title

• B23K35/3615

  N-compounds · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title

• C22C13/00

  Alloys based on tin · CPC title

• C08L83/04

  Polysiloxanes · CPC title