Flux for resin-cored solder, resin-cored solder, and soldering method

Patent metadata

Field	Value
Publication number	US-12017307-B2
Application number	US-202118266377-A
Country	US
Kind code	B2
Filing date	Nov 10, 2021
Priority date	Dec 11, 2020
Publication date	Jun 25, 2024
Grant date	Jun 25, 2024

Abstract

Provided is a flux for resin-cored solder that is used in resin-cored solder that is supplied into a through hole formed along a central axis of a soldering iron. The flux includes 60% by mass to 99.9% by mass of a rosin ester to a total mass of the flux, 0.1% by mass to 15% by mass of a covalent halogen compound to the total mass of the flux, and more than 0% by mass to 10% by mass of rosin amine, N,N-diethyloctylamine, or rosin amine and N,N-diethyloctylamine to the total mass of the flux.

First claim

The invention claimed is:

1. A flux for resin-cored solder that is used in resin-cored solder that is supplied into a through hole formed along a central axis of a soldering iron, comprising:
60% by mass to less than 99.9% by mass of a rosin ester relative to a total mass of the flux; and
0.1% by mass to 15% by mass of a covalent halogen compound relative to the total mass of the flux; and
more than 0% by mass to 10% by mass of rosin amine, N,N-diethyloctylamine, or rosin amine and N,N-diethyloctylamine relative to the total mass of the flux.

2. The flux for resin-cored solder according to claim 1 , wherein the covalent halogen compound is one or two or more of trans-2,3-dibromo-1,4-butenediol, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2,3-dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol, trans-2,3-dibromo-2-butene-1,4-diol, cis-2,3-dibromo-2-butene-1,4-diol, 2,2-bis(bromomethyl)-1,3-propanediol, tetrabromoethane, tetrabromobutane, tetrabromophthalic acid, bromosuccinic acid, and 2,2,2-tribromoethanol.

3. The flux for resin-cored solder according to claim 1 , wherein the rosin ester is one or more rosin esters each being one rosin esterified or one or more rosin esters each being a mixture of two or more rosin esterified, and the rosin to be esterified is any or any mixture of natural rosin and rosin derivatives obtained from the natural rosin, wherein the rosin derivatives are: purified rosin; polymerized rosin; hydrogenated rosin; disproportionated rosin, hydrogenated disproportionated rosin; acid-modified rosin; phenol-modified rosin; an α, β-unsaturated carboxylic acid-modified product; a purified product, a hydride and a disproportionated product of the polymerized rosin; and a purified product, a hydride and a disproportionated product of the α, β-unsaturated carboxylic acid-modified product.

4. The flux for resin-cored solder according to claim 1 , further comprising 0% by mass to 39% by mass of another rosin relative to the total mass of the flux.

5. The flux for resin-cored solder according to claim 1 , further comprising more than 0% by mass to 39% by mass of an activator other than the covalent halogen compound relative to the total mass of the flux.

6. A resin-cored solder comprising solder filled with the flux for resin-cored solder according to claim 1 .

7. A soldering method comprising:
supplying a resin-cored solder that is solder filled with a flux for resin-cored solder including 60% by mass to less than 99.9% by mass of a rosin ester relative to a total amount of the flux, and 0.1% by mass to 15% by mass of a covalent halogen compound relative to the total mass of the flux, and more than 0% by mass to 10% by mass of rosin amine, N,N-diethyloctylamine, or rosin amine and N,N-diethyloctylamine relative to the total mass of the flux into a through hole formed along a central axis of a soldering iron; and
heating the resin-cored solder to a temperature exceeding a melting point of the solder with the soldering iron, thereby heating a joining object and melting the resin-cored solder.

Assignees

• Senju Metal Industry Co
• Denso Corp

Inventors

• Kurasawa Yoko
• ONITSUKA Motohiro
• TOKUTOMI Hisashi
• Endo Kei
• Hamamoto Kazuyuki

Classifications

• B23K35/3616

  Halogen compounds · CPC title

• B23K35/3613

  Polymers, e.g. resins · CPC title

• B23K1/203

  Fluxing, i.e. applying flux onto surfaces · CPC title

• B23K3/02

  Soldering irons; Bits · CPC title

• B23K35/0205

  Non-consumable electrodes; C-electrodes · CPC title