Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same

Patent metadata

Field	Value
Publication number	US-9707642-B2
Application number	US-201314071928-A
Country	US
Kind code	B2
Filing date	Nov 5, 2013
Priority date	Dec 7, 2012
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy.

First claim

What is claimed is:

1. A solder composition comprising:
a metal or a metal alloy; and
an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy; where the metal or metal alloy forms a matrix of the solder composition; where the electrically conductive high temperature polymeric composition comprises a high temperature polymer and an electrically conducting filler; where the high temperature polymer has a glass transition temperature or a melting point that is greater than or equal to 175° C.; where the high temperature polymer comprises polyether sulfone, polyetherether ketone, polyaryletherketones, polyphenylene sulfone ureas, polybenzoxazoles, polyoxadiazoles, polybenzothiazinophenothiazines, polybenzothiazoles, polypyrazinoquinoxalines, polypyromellitimides, polyquinoxalines, polybenzimidazoles, polyoxindoles, polyoxoisoindolines, polydioxoisoindolines, polytriazines, polypyridazines, polypiperazines, polypyridines, polypiperidines, polytriazoles, polypyrazoles, polypyrrolidines, polycarboranes, polyoxabicyclononanes, polydibenzofurans, or a combination comprising at least one of the foregoing polymers.

2. The solder composition of claim 1 , where the electrically conducting filler comprises a carbonaceous material.

3. The solder composition of claim 2 , wherein the carbonaceous material comprises carbon fiber, carbon nanotubes, carbon black, graphite, graphene, or a combination comprising at least one of the foregoing carbonaceous materials.

4. The solder composition of claim 2 , wherein the carbonaceous materials are coated with a metal; where the metal is selected from the group consisting of cadmium, chromium, copper, aluminum, cobalt, brass, iridium, iron, lead, molybdenum, nickel, platinum, ruthenium steel, selenium, tin, titanium, tungsten, vanadium, zinc, and a combination comprising at least one of the foregoing metals.

5. The solder composition of claim 2 , where the electrically conducting filler comprises a metal powder; where the metal for the metal powder is selected from the group consisting of cadmium, chromium, copper, aluminum, cobalt, brass, iridium, iron, lead, molybdenum, nickel, platinum, ruthenium steel, selenium, tin, titanium, tungsten, vanadium, zinc, and a combination comprising at least one of the foregoing metals.

6. The solder composition of claim 1 , where the electrically conductive high temperature polymeric composition has an average particle size of 1 micrometers to 100 micrometers.

7. The solder composition of claim 1 , where the solder composition has an electrical conductivity from 10 2 Siemens per meter to 10 5 Siemens per meter.

8. The solder composition of claim 1 , where the electrically conductive high temperature polymeric composition has an electrical conductivity from 0.1 Siemens per meter to 500 Siemens per meter.

9. The solder composition of claim 1 , where the metal or a metal alloy that has a flow temperature below 350° C.

10. The solder composition of claim 9 , where the metal or metal alloy comprises a base metal and a secondary metal; where the base metal is selected from the group consisting of cadmium, bismuth, tin, lead, selenium, or a combination comprising at least one of the foregoing metals or metal alloys.

11. The solder composition of claim 9 , where the secondary metal is selected from the group consisting of cadmium, bismuth, tin, lead, selenium, or a combination comprising at least one of the foregoing metals or metal alloys.

Assignees

• Gerrard David Peter
• Roy Sayantan
• Baker Hughes Inc

Inventors

• Gerrard David Peter
• Roy Sayantan

Classifications

• B23K35/3612

  with organic compounds as principal constituents · CPC title

• B23K35/286

  Al as the principal constituent · CPC title

• B23K35/3046

  Co as the principal constituent · CPC title

• B23K35/302

  Cu as the principal constituent · CPC title

• B23K35/268

  Pb as the principal constituent · CPC title