Flux and solder paste
US-2024278360-A1 · Aug 22, 2024 · US
Flux and method for manufacturing semiconductor device
US2016354871A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016354871-A1 |
| Application number | US-201615097516-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 13, 2016 |
| Priority date | Jun 3, 2015 |
| Publication date | Dec 8, 2016 |
| Grant date | — |
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- Title
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Abstract
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A flux includes: a first glycol-based polyhydric alcohol having a molecular weight of 300 or less; and a second glycol-based polyhydric alcohol having a molecular weight of 600 or more.
First claim
Opening claim text (preview).
What is claimed is: 1 . A flux comprising: a first glycol-based polyhydric alcohol having a molecular weight of 300 or less; and a second glycol-based polyhydric alcohol having a molecular weight of 600 or more. 2 . The flux according to claim 1 , wherein the first glycol-based polyhydric alcohol is a polyethylene glycol having a molecular weight of 200 or more, and the second glycol-based polyhydric alcohol is a polyethylene glycol having a molecular weight of 1,000 or less. 3 . The flux according to claim 1 , wherein the first glycol-based polyhydric alcohol is a tetraethylene glycol, and the second glycol-based polyhydric alcohol is the polyethylene glycol having a molecular weight of 1,000 or less. 4 . The flux according to claim 1 , wherein more of the first glycol-based polyhydric alcohols than the second glycol-based polyhydric alcohols is contained in the flux. 5 . The flux according to claim 1 , wherein the content of the first glycol-based polyhydric alcohol and the second glycol-based polyhydric alcohol in the flux is 80% or more. 6 . The flux according to claim 1 , wherein the flux contains an organic acid or an organic acid anhydride. 7 . The flux according to claim 1 , wherein a volatilization temperature of the first glycol-based polyhydric alcohol is lower than a reflow temperature of a SnAg based solder, and a volatilization temperature of the second glycol-based polyhydric alcohol is higher than the reflow temperature of the SnAg based solder. 8 . A method for manufacturing a semiconductor device, comprising: preparing a semiconductor chip or a semiconductor package and a circuit board; and bonding the semiconductor chip or the semiconductor package with the circuit board by reflowing an SnAg based solder using a flux which contains a first glycol-based polyhydric alcohol having a molecular weight of 300 or less and a second glycol-based polyhydric alcohol having a molecular weight of 600 or more. 9 . The method according to claim 8 , wherein gaps between a plurality of terminals in a bonding portion of the semiconductor chip or the semiconductor package with the circuit board are 100 μm or less. 10 . The method according to claim 8 , wherein the first glycol-based polyhydric alcohol is a polyethylene glycol having a molecular weight of 200 or more, and the second glycol-based polyhydric alcohol is a polyethylene glycol having a molecular weight of 1,000 or less. 11 . The method according to claim 8 , wherein the first glycol-based polyhydric alcohol is a tetraethylene glycol, and the second glycol-based polyhydric alcohol is the polyethylene glycol having a molecular weight of 1,000 or less. 12 . The method according to claim 8 , wherein more of the first glycol-based polyhydric alcohols than the second glycol-based polyhydric alcohols is contained in the flux. 13 . The method according to claim 8 , wherein the content of the first glycol-based polyhydric alcohol and the second glycol-based polyhydric alcohol in the flux is 80% or more. 14 . The method according to claim 8 , wherein the flux contains an organic acid or an organic acid anhydride. 15 . The method according to claim 8 , wherein a volatilization temperature of the first glycol-based polyhydric alcohol is lower than a reflow temperature of a SnAg based solder, and a volatilization temperature of the second glycol-based polyhydric alcohol is higher than the reflow temperature of the SnAg based solder.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Soldering or alloying · CPC title
Using a reflow oven · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
Treating the bond pad before connecting, e.g. by applying flux or cleaning · CPC title
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Frequently asked questions
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- What does patent US2016354871A1 cover?
- A flux includes: a first glycol-based polyhydric alcohol having a molecular weight of 300 or less; and a second glycol-based polyhydric alcohol having a molecular weight of 600 or more.
- Who is the assignee on this patent?
- Fujitsu Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K35/3613. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Dec 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).