Flux for soldering and solder paste composition

Patent metadata

Field	Value
Publication number	US-9844840-B2
Application number	US-201414495901-A
Country	US
Kind code	B2
Filing date	Sep 25, 2014
Priority date	Sep 30, 2013
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

A flux for soldering includes a base resin, a solvent, and an activating agent. The base resin contains a rosin. An amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to a total amount of the base resin. The activating agent includes a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1).

X is (a) one or more carboxyl groups, or (b) one or more carboxyl groups and at least one selected from a hydrogen atom, chloro group, bromo group, alkyl group, and cyclohexyl group. A position of the X is not limited. A number of the X is one or more. The X may have either one of the (a) and (b) alone, or a plurality of the (a) and (b) in combination.

First claim

What is claimed is:

1. A flux for soldering, comprising:
a base resin containing an acrylic resin and a rosin, an amount of the rosin to be incorporated being from 0% by weight to 30% by weight with respect to a total amount of the base resin;
a solvent; and
an activating agent including a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1)

wherein X is (a) one or more carboxyl groups, or (b) one or more carboxyl groups and at least one selected from a hydrogen atom, chloro group, bromo group, alkyl group, and cyclohexyl group,
a position of the X is not limited,
a number of the X is one or more, and
the X may have either one of the (a) and (b) alone, or a plurality of the (a) and (b) in combination, and
wherein an amount of the activating agent to be incorporated is from 5% by weight to 15% by weight with respect to the total amount of the flux for soldering.

2. The flux for soldering according to claim 1 , wherein an amount of the compound to be incorporated having a plurality of carboxyl groups on a cyclohexyl structure represented by the general formula (1) is of 0.5% by weight or more with respect to a total amount of the flux for soldering.

3. The flux for soldering according to claim 1 , wherein the compound having a plurality of carboxyl groups on a cyclohexyl structure represented by the general formula (1) is at least one of cyclohexanedicarboxylic acid, hydrogenated trimellitic acid, and hydrogenated pyromellitic acid.

4. The flux for soldering according to claim 1 ,
wherein an amount of the base resin to be incorporated is from 30% by weight to 60% by weight with respect to a total amount of the flux for soldering,
an amount of the solvent to be incorporated is from 20% by weight to 50% by weight with respect to the total amount of the flux for soldering,
the amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to the total amount of the base resin, and
an amount of the compound to be incorporated having a plurality of carboxyl groups on a cyclohexyl structure represented by the general formula (1) is of 0.5% by weight or more with respect to the total amount of the flux for soldering.

5. A solder paste composition, comprising:
a solder alloy powder; and
a flux for soldering, comprising:
a base resin containing an acrylic resin and a rosin, an amount of the rosin to be incorporated being from 0% by weight to 30% by weight with respect to a total amount of the base resin;
a solvent; and
an activating agent including a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1)

wherein X is (a) one or more carboxyl groups, or (b) one or more carboxyl groups and at least one selected from a hydrogen atom, chloro group, bromo group, alkyl group, and cyclohexyl group,
a position of the X is not limited,
a number of the X is one or more, and
the X may have either one of the (a) and (b) alone, or a plurality of the (a) and (b) in combination, and
wherein an amount of the activating agent to be incorporated is from 5% by weight to 15% by weight with respect to the total amount of the flux for soldering.

Assignees

• Tamura Seisakusho Kk

Inventors

• Tsuchiya Masahiro
• Kitamura Akira
• Seino Momoko
• Arai Masaya

Classifications

• B23K35/025

  Pastes, creams or slurries · CPC title

• B23K35/362

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title

• B23K35/3612 Primary

  with organic compounds as principal constituents · CPC title