Laser machining device for use in patterning
US-9527160-B2 · Dec 27, 2016 · US
Shaping the laser spot
Shaping the laser spot · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K26/073 |
| Official title | Shaping the laser spot |
| Display label | Shaping the laser spot |
| Total patents | 691 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 33 |
| 2016 | 32 |
| 2017 | 38 |
| 2018 | 52 |
| 2019 | 58 |
| 2020 | 83 |
| 2021 | 92 |
| 2022 | 60 |
| 2023 | 92 |
| 2024 | 73 |
| 2025 | 62 |
| 2026 | 16 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for generating an ablation program, method for ablating a body and means for carrying out said method
US-2016346118-A1 · Dec 1, 2016 · US
Customized pupil stop shape for control of edge profile in laser annealing systems
US-2016327801-A1 · Nov 10, 2016 · US
Attaching optical components using homogenized laser light
US-9484047-B2 · Nov 1, 2016 · US
Method and arrangement for generating a laser beam having a differing beam profile characteristic by a multi-clad fiber
US-9482821-B2 · Nov 1, 2016 · US
Beam shapers, annealing systems employing the same, methods of heat treating substrates and methods of fabricating semiconductor devices
US-9466490-B2 · Oct 11, 2016 · US
Method for manufacturing deposition mask and deposition mask
US-2016281209-A1 · Sep 29, 2016 · US
Cathode cutting device using laser
US-2016263705-A1 · Sep 15, 2016 · US
Laser processing systems capable of dithering
US-2016228988-A1 · Aug 11, 2016 · US
Laser processing method
US-9409256-B2 · Aug 9, 2016 · US
Laser welding condition determination method and laser welding device
US-2016207142-A1 · Jul 21, 2016 · US
Sealing apparatus, substrate-sealing apparatus including the same and substrate-sealing method
US-9393642-B2 · Jul 19, 2016 · US
Attaching optical components using homogenized laser light
US-2016171991-A1 · Jun 16, 2016 · US
Control of solidification in laser powder bed fusion additive manufacturing using a diode laser fiber array
US-2016158889-A1 · Jun 9, 2016 · US
Method for generating an ablation program, method for ablating a body and means for carrying out said method
US-9352415-B2 · May 31, 2016 · US
Device and Method for Laser Material Processing
US-2016147075-A1 · May 26, 2016 · US
Varying beam parameter product of a laser beam
US-2016116679-A1 · Apr 28, 2016 · US
Semiconductor element
US-9324791-B2 · Apr 26, 2016 · US
Attaching optical components using homogenized laser light
US-9318134-B2 · Apr 19, 2016 · US
Method of dicing thin semiconductor substrates
US-9312178-B2 · Apr 12, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K26/073?
- CPC B23K26/073 is the Cooperative Patent Classification code for “Shaping the laser spot.”
- How many patents are filed under CPC B23K26/073 (Shaping the laser spot)?
- Our database includes 691 publications tagged with this CPC code.
- Is patent activity under CPC B23K26/073 growing?
- Publication counts under this code: 73 in 2024 vs 62 in 2025 (latest complete years).