Laser processing method

Patent metadata

Field	Value
Publication number	US-9409256-B2
Application number	US-201113701031-A
Country	US
Kind code	B2
Filing date	May 20, 2011
Priority date	Jun 2, 2010
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

To provide a laser processing method which is capable of enhancing the dividing performance according to a required quality. By irradiating an object to be processed with a laser light L having a pulse waveform in which its half width and its bottom width are equal to one another, a plurality of modified spots are formed along a line to cut inside the object, and a modified region is formed with the plurality of modified spots. Here, a laser light source 101 controls a drive power source 51 by a laser light source controller 102 , to switch among a pulse waveform among first to third pulse waveforms according to a PE value of the laser light L. In the case of a low PE value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform, and in the case of a high PE value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as the pulse waveform.

First claim

The invention claimed is:

1. A laser processing method for forming a modified region along a line to cut in an object to be processed by collecting a laser light onto the object and monitoring pulse energy, the method comprising:
a modified region forming step of forming a plurality of modified spots along the line by irradiating the object with the laser light having a pulse waveform in which its half width and a time width from a rise to a fall are equal to one another, to form the modified region with the plurality of modified spots, wherein, in the modified region forming step,
when the monitored pulse energy of the laser light is at a first value lower than a predetermined value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform, and
when the monitored pulse energy is at a second value higher than the predetermined value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as the pulse waveform.

2. The laser processing method according to claim 1 , wherein
the first pulse waveform is a waveform which steeply rises to reach a peak value, and thereafter gradually declines, and thereafter steeply falls, and
the second pulse waveform is a waveform which steeply rises, and thereafter gradually ascends to reach a peak value, and thereafter steeply falls.

3. The laser processing method according to claim 1 , wherein, in the modified region forming step,
when the monitored pulse energy is at the predetermined value, a third pulse waveform formed into a rectangular form is set as the pulse waveform.

4. The laser processing method according to claim 1 , wherein, in the modified region forming step,
when the modified spots are formed on an opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the first value.

5. The laser processing method according to claim 1 , wherein, in the modified region forming step,
when the modified spots are formed on the opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the second value.

6. The laser processing method according to claim 2 , wherein, in the modified region forming step,
when the pulse energy is at the predetermined value, a third pulse waveform formed into a rectangular form is set as the pulse waveform.

7. The laser processing method according to claim 2 , wherein, in the modified region forming step,
when the modified spots are formed on an opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the first value.

8. The laser processing method according to claim 3 , wherein, in the modified region forming step,
when the modified spots are formed on an opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the first value.

9. The laser processing method according to claim 6 , wherein, in the modified region forming step,
when the modified spots are formed on an opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the first value.

10. The laser processing method according to claim 2 , wherein, in the modified region forming step,
when the modified spots are formed on the opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the second value.

11. The laser processing method according to claim 3 , wherein, in the modified region forming step,
when the modified spots are formed on the opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the second value.

12. The laser processing method according to claim 6 , wherein, in the modified region forming step,
when the modified spots are formed on the opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the second value.

13. The laser processing method according to claim 1 , wherein the modified region is formed in the object through internal absorption type laser processing.

14. A laser processing method for forming a modified region along a line to cut in an object to be processed by collecting a laser light onto the object, the method comprising:
a modified region forming step of forming a plurality of modified spots along the line by irradiating the object with the laser light having a pulse waveform in which its half width and a time width from a rise to a fall are equal to one another, to form the modified region with the plurality of modified spots, wherein, in the modified region forming step,
when the pulse energy of the laser light is at a first value lower than a predetermined value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform,
when the pulse energy is at a second value higher than the predetermined value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as the pulse waveform, and
when the pulse energy is at the predetermined value, a third pulse waveform formed into a rectangular form is set as the pulse waveform.

15. A laser processing method for forming a modified region along a line to cut in an object to be processed by collecting a laser light onto the object, the method comprising:
a modified region forming step of forming a plurality of modified spots along the line by irradiating the object with the laser light having a pulse waveform in which its half width and a time width from a rise to a fall are equal to one another, to form the modified region with the plurality of modified spots, wherein, in the modified region forming step,
when the pulse energy of the laser light is at a first value lower than a predetermined value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform,
when the pulse energy is at a second value higher than the predetermined value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as the pulse waveform, and
when the modified spots are formed on an opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the first value.

16. A laser processing method for forming a modified region along a line to cut in an object to be processed by collecting a laser light onto the object, the method comprising:
a modified region forming step of forming a plurality of modified spots along the line by irradiating the object with the laser light having a pulse waveform in which its half width and a time width from a rise to a fall are equal to one another, to form the modified region with the plurality of modified spots, wherein, in the modified region forming step,
when the pulse energy of the laser light is at a first value lower than a predetermined value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform, and
when the pulse energy is at a second value higher than the predetermined value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as the pulse waveform,
when the modified spots are formed on the opposite surface side of the laser light irradiated surface in the object, the pulse energy is at the second value.

Assignees

• Sugiura Ryuji
• Hamamatsu Photonics Kk

Inventors

• Sugiura Ryuji

Classifications

• B23K26/0622 Primary

  by shaping pulses · CPC title

• B23K2103/50

  Inorganic materials other than metals or composite materials · CPC title

• B23K26/53

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title

• B23K26/38 Primary

  by boring or cutting · CPC title