Attaching optical components using homogenized laser light

Patent metadata

Field	Value
Publication number	US-9484047-B2
Application number	US-201615052987-A
Country	US
Kind code	B2
Filing date	Feb 25, 2016
Priority date	Jun 1, 2012
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

An attachable optical component is aligned with a base optical component. The attachable optical component has a mounting surface interfacing with the base optical component and an exposed surface opposed to the mounting surface. Laser light is directed to the exposed surface of the attachable optical component for delivery to the mounting surface. The attachable optical component guides and homogenizes the laser light delivered to the mounting surface and uniformly heats a bonding feature between the mounting surface and the base optical component. The directing and subsequent removing of the laser light bonds the attachable optical component to the base optical component via the bonding feature

First claim

What is claimed is:

1. An apparatus, comprising:
a base optical component comprising a bonding region;
a bonding feature proximate the bonding region; and
an attachable optical component having a mounting surface facing the bonding feature and an exposed surface, wherein the attachable optical component comprises a laser beam homogenizer and a reflector between the exposed surface and bonding surface such that laser light directed to the exposed surface is directed via the laser beam homogenizer to uniformly heat the bonding feature to bond the attachable optical component to the base optical component.

2. The apparatus of claim 1 , wherein the exposed surface is opposed to the mounting surface.

3. The apparatus of claim 1 , wherein the exposed surface is at an angle to the mounting surface, and wherein the laser beam homogenizer further comprises a reflector that reflects the light received at the exposed surface to the bonding feature.

4. The apparatus of claim 1 , wherein the attachable optical component comprises a laser submount and the base optical component comprises a slider body.

5. The apparatus of claim 1 , wherein the laser beam homogenizer comprises a prism.

6. The apparatus of claim 1 , wherein the bonding feature comprises a solder pad.

7. The apparatus of claim 1 , wherein the base optical component comprises:
a second exposed surface opposed to the bonding region; and
a second laser beam homogenizer between the second exposed surface and the bonding region such that laser light directed to the second exposed surface further heats the bonding feature.

8. An apparatus, comprising:
a base optical component comprising a bonding region;
a bonding feature proximate the bonding region; and
an attachable optical component having a mounting surface facing the bonding feature and an exposed surface opposed to the mounting surface, wherein the attachable optical component comprises a laser beam homogenizer between the exposed surface and bonding surface such that laser light directed to the exposed surface uniformly heats the bonding feature to bond the attachable optical component to the base optical component.

9. The apparatus of claim 8 , wherein the attachable optical component comprises a laser submount and the base optical component comprises a slider body.

10. The apparatus of claim 9 , wherein the laser submount comprises a laser mounted on a surface normal to the exposed surface.

11. The apparatus of claim 8 , wherein the attachable optical component comprises a slider body submount and the base optical component comprises a submount or slider.

12. The apparatus of claim 8 , wherein the bonding feature comprises a solder pad.

13. The apparatus of claim 8 , wherein the laser beam homogenizer comprises a silicon prism.

14. The apparatus of claim 8 , wherein the laser beam homogenizer comprises a rectangular prism.

15. The apparatus of claim 8 , wherein the exposed surface comprises a diffraction grating.

16. The apparatus of claim 8 , wherein the base optical component comprises:
a second exposed surface opposed to the bonding region; and
a second laser beam homogenizer between the second exposed surface and the bonding region such that laser light directed to the second exposed surface further heats the bonding feature.

17. The apparatus of claim 16 , further comprising first and second optical fibers that direct light to the respective exposed surface and second exposed surface to heat the bonding feature.

18. The apparatus of claim 17 , wherein the light from the first and second optical fibers is phase adjusted to precisely shape the heating of the bonding feature.

19. The apparatus of claim 17 , wherein the first and second optical fibers carry light of different wavelengths.

20. The apparatus of claim 17 , wherein one of the first and second fibers is used for a preheat operation and another of the first and second fibers is used for reflow of the bonding feature.

Assignees

• Seagate Technology Llc

Inventors

• Roeger Brent C
• Tatah Karim

Classifications

• B23K1/0056

  soldering by means of beams, e.g. lasers, electron beams [EB] · CPC title

• B23K26/0643

  comprising mirrors · CPC title

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

• G11B5/1272 Primary

  Assembling or shaping of elements (G11B5/1278 takes precedence) · CPC title

• G11B5/105 Primary

  Mounting of head within housing {or assembling of head and housing (G11B5/3103 takes precedence)} · CPC title