Laser machining device for use in patterning

Patent metadata

Field	Value
Publication number	US-9527160-B2
Application number	US-201314389123-A
Country	US
Kind code	B2
Filing date	Mar 25, 2013
Priority date	Mar 27, 2012
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

A beam head unit including beam heads configured to scan a single laser beam on a thin-film layer of a workpiece from an irradiation start side toward an irradiation end side in a direction crossing a feeding direction of the workpiece while the workpiece is fed by a constant-speed feeder; laser oscillator configured to emit the laser beam to irradiate each beam head; a controller configured to control scanning speed of the laser beam emitted from each beam head and feeding speed of the workpiece to control a machining line formed in the workpiece fed at the predetermined feeding speed. The controller is configured to switch a beam head to use to form the machining line between the beam heads to form the machining line alternately. This configuration makes it possible to form machining lines highly efficiently in the thin-film layer of the workpiece while feeding the workpiece.

First claim

The invention claimed is:

1. A laser machining device for use in patterning, which is configured to form a machining line in a thin-film layer formed on a workpiece by using a laser beam, the laser machining device comprising:
a constant-speed feeder configured to feed the workpiece in a single feeding direction at a predetermined feeding speed;
a beam head unit including a plurality of beam heads,
each beam head being configured to scan a single laser beam on the thin-film layer of the workpiece from an irradiation start side toward an irradiation end side in a direction crossing the feeding direction of the workpiece while either the workpiece is being fed by the constant-speed feeder at the predetermined feeding speed or the workpiece is being fed by the constant-speed feeder and the feeding speed of the workpiece is being detected;

a laser oscillator configured to emit the laser beam to irradiate each beam head with the laser beam; and
a controller configured to control a scanning speed of the laser beam emitted from each beam head and the feeding speed of the workpiece in relation to each other to control the machining line formed in the workpiece fed at the predetermined feeding speed, wherein
the controller is configured to switch a beam head or beam heads to use to form the machining line or machining lines among the plurality of beam heads to form the machining line alternately or the machining lines concurrently.

2. The laser machining device for use in patterning according to claim 1 , comprising a switching unit configured to switch the beam head that is to be irradiated with the laser beam emitted from the laser oscillator among the plurality of beam heads, wherein
the beam head unit is configured as a reciprocating motion system, in which while at least one of the beam heads is moving from the irradiation start side toward the irradiation end side and performing laser machining, at least one of the beam heads is returned to the irradiation start side, and
the controller is configured to cause the switching unit to perform switching such that the beam head that performs the laser machining is irradiated with the laser beam.

3. The laser machining device for use in patterning according to claim 1 , comprising a shutting device configured to prevent each beam head from being irradiated with the laser beam emitted from the laser oscillator, wherein
the beam head unit is configured as a circulating system, in which while at least one of the beam heads is moving from the irradiation start side toward the irradiation end side and performing laser machining, at least one of the beam heads is returned to the irradiation start side, and
the controller is configured to control the shutting device such that the beam head that performs the laser machining is irradiated with the laser beam.

4. The laser machining device for use in patterning according to claim 3 , wherein
the beam head unit includes a circulating mechanism configured to cause the plurality of beam heads to circulate horizontally or vertically.

5. The laser machining device for use in patterning according to claim 2 , wherein the beam head unit includes an optical path length stabilizing mechanism configured to make constant an optical path length of the laser beam that irradiates the plurality of beam heads.

6. The laser machining device for use in patterning according to claim 5 , wherein the controller is configured to determine a scanning position on the workpiece in the feeding direction of the workpiece based on arrangement of the plurality of beam heads, one of the beam heads that performs the laser machining, and the feeding speed of the workpiece.

7. The laser machining device for use in patterning according to claim 3 , wherein the beam head unit includes an optical path length stabilizing mechanism configured to make constant an optical path length of the laser beam that irradiates the plurality of beam heads.

Assignees

• Kawasaki Heavy Ind Ltd

Inventors

• Nakazawa Mutsuhiro
• Takahara Kazunori
• Oogushi Osami

Classifications

• H10F19/33

  Patterning processes to connect the photovoltaic cells, e.g. laser cutting of conductive or active layers · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title

• B23K26/0087

  Operations & Transport · mapped topic

• B23K26/073

  Shaping the laser spot · CPC title

• B23K26/083

  Devices involving movement of the workpiece in at least one axial direction · CPC title