Apparatus and method for fabricating periodic micro-pattern by laser beams
US-9586286-B2 · Mar 7, 2017 · US
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Operations & Transport
Operations & Transport · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K26/0656 |
| Official title | — |
| Display label | Operations & Transport (mapped technology topic) |
| Total patents | 20 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity appears to be declining based on the most recent years.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 4 |
| 2017 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Laser irradiation method and laser irradiation apparatus
US-9296068-B2 · Mar 29, 2016 · US
Laser irradiation device and laser induced thermal imaging method
US-9272364-B2 · Mar 1, 2016 · US
Mask for evaporation, and method and apparatus for manufacturing the same
US-9259805-B2 · Feb 16, 2016 · US
Patterning of silicon oxide layers using pulsed laser ablation
US-9236510-B2 · Jan 12, 2016 · US
Method and apparatus for removing material from a cutting insert using electromagnetic radiation
US-2015231736-A1 · Aug 20, 2015 · US
Debris minimization and improved spatial resolution in pulsed laser ablation of materials
US-9102008-B2 · Aug 11, 2015 · US
Apparatus and method for laser sealing
US-9095032-B2 · Jul 28, 2015 · US
Laser annealing device
US-9061368-B2 · Jun 23, 2015 · US
Laser processing of a bed of powdered material with variable masking
US-2015132173-A1 · May 14, 2015 · US
Apparatus and method for fabricating periodic micro-pattern by laser beams
US-2015122786-A1 · May 7, 2015 · US
Method of cutting a wafer-like object and semiconductor chip
US-8969761-B2 · Mar 3, 2015 · US
Laser machining device and laser machining method
US-8957349-B2 · Feb 17, 2015 · US
Laser crystallization apparatus and method for manufacturing thin film transistor array panel using the same
US-8952289-B2 · Feb 10, 2015 · US
Laser processing method and laser processing apparatus
US-8946592-B2 · Feb 3, 2015 · US
Method of manufacturing a semiconductor device formed using a substrate cutting method
US-8946591-B2 · Feb 3, 2015 · US
Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US-8946589-B2 · Feb 3, 2015 · US
Laser processing method and laser processing apparatus
US-8937264-B2 · Jan 20, 2015 · US
Method of cutting a substrate and method of manufacturing a semiconductor device
US-8933369-B2 · Jan 13, 2015 · US
Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US-8927900-B2 · Jan 6, 2015 · US