Semiconductor die, semiconductor package and substrate dicing method
US-2024421000-A1 · Dec 19, 2024 · US
Laser processing method and laser processing apparatus
US8937264B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8937264-B2 |
| Application number | US-201213432949-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 28, 2012 |
| Priority date | Sep 13, 2000 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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Abstract
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A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
First claim
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What is claimed is: 1. A method of manufacturing a semiconductor device comprising the steps of: irradiating a substrate with laser light comprising a pulsed laser light at a converging point within the substrate, so that the converging point of the pulsed laser light is positioned within the substrate, in order to form a molten processed spot within the substrate at the converging point; performing the irradiating step at multiple locations along each of a plurality of intersec…
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- What does patent US8937264B2 cover?
- A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the insid…
- Who is the assignee on this patent?
- Fukuyo Fumitsugu, Fukumitsu Kenshi, Uchiyama Naoki, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10P54/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).