Wafer producing method
US-9764420-B2 · Sep 19, 2017 · US
Operations & Transport
Operations & Transport · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K2203/56 |
| Official title | — |
| Display label | Operations & Transport (mapped technology topic) |
| Total patents | 179 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity appears to be declining based on the most recent years.
| Year | Patents |
|---|---|
| 2016 | 55 |
| 2017 | 66 |
| 2018 | 57 |
| 2019 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
High-efficiency line-forming optical systems and methods for defect annealing and dopant activation
US-9711361-B2 · Jul 18, 2017 · US
High-efficiency line-forming optical systems and methods for defect annealing and dopant activation
US-9613815-B2 · Apr 4, 2017 · US
Laser processing apparatus
US-2017087663-A1 · Mar 30, 2017 · US
Method for bonding with a silver paste
US-9589925-B2 · Mar 7, 2017 · US
Laser machining device for use in patterning
US-9527160-B2 · Dec 27, 2016 · US
Systems and methods for producing silicon slim rods
US-9527158-B2 · Dec 27, 2016 · US
Method of manufacturing semiconductor device and semiconductor device
US-2016372583-A1 · Dec 22, 2016 · US
Laser processing apparatus and method of forming through-hole
US-2016368088-A1 · Dec 22, 2016 · US
Wafer producing method
US-9517530-B2 · Dec 13, 2016 · US
Wafer producing method
US-2016354862-A1 · Dec 8, 2016 · US
Wafer producing method
US-2016354863-A1 · Dec 8, 2016 · US
Pulse train annealing method and apparatus
US-9498845-B2 · Nov 22, 2016 · US
Laser working method, laser working apparatus, and its manufacturing method
US-2016329246-A1 · Nov 10, 2016 · US
Wafer producing method
US-9481051-B2 · Nov 1, 2016 · US
Laser irradiation method and laser irradiation apparatus
US-2016311057-A1 · Oct 27, 2016 · US
Method and device for cutting wafers
US-2016315010-A1 · Oct 27, 2016 · US
Laser processing method and laser processing apparatus
US-9475152-B2 · Oct 25, 2016 · US
Workpiece cutting method
US-9478696-B2 · Oct 25, 2016 · US
Thin plate separating method
US-2016307763-A1 · Oct 20, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K2203/56?
- CPC B23K2203/56 is the Cooperative Patent Classification code for “Operations & Transport.”
- How many patents are filed under CPC B23K2203/56 (Operations & Transport)?
- Our database includes 179 publications tagged with this CPC code.
- Is patent activity under CPC B23K2203/56 growing?
- Publication counts under this code: 57 in 2018 vs 1 in 2019 (latest complete years).