Pulse train annealing method and apparatus
US-2016023302-A9 · Jan 28, 2016 · US
US9498845B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9498845-B2 |
| Application number | US-201213707476-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 6, 2012 |
| Priority date | Nov 8, 2007 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present invention generally describes apparatuses and methods used to perform an annealing process on desired regions of a substrate. In one embodiment, pulses of electromagnetic energy are delivered to a substrate using a flash lamp or laser apparatus. The pulses may be from about 1 nsec to about 10 msec long, and each pulse has less energy than that required to melt the substrate material. The interval between pulses is generally long enough to allow the energy imparted by each pulse to dissipate completely. Thus, each pulse completes a micro-anneal cycle. The pulses may be delivered to the entire substrate at once, or to portions of the substrate at a time. Further embodiments provide an apparatus for powering a radiation assembly, and apparatuses for detecting the effect of pulses on a substrate.
Opening claim text (preview).
The invention claimed is: 1. An apparatus for treating a substrate, comprising: a first laser source comprising a switch optically coupled to a laser radiation source; a substrate support movably disposed along an optical path of the laser radiation; a capacitor and a power supply, wherein the power supply is configured to charge the capacitor; a controller coupled to the substrate support, the power supply, and to the switch to form pulses of electromagnetic radiation; wherein the controller is configured to operate the switch to generate pulses of laser radiation with an interval between pulses of between 1 msec and 20 msec; wherein the controller is configured to operate the switch to generate a pulse train with an interval between pulses that dissipates the energy of one pulse within a substrate before the next pulse impacts the substrate; wherein the controller is configured to operate the switch to generate a pulse train of laser radiation; wherein the switch is an optical switch, a Pockels cell, or a fast shutter; an optical assembly disposed along the optical path of the laser radiation between the laser radiation source and the substrate support; wherein the optical assembly is positioned to receive the pulses of electromagnetic radiation and direct a pulse train of temporally shaped identical pulses of electromagnetic radiation, wherein the duration of each pulse is between about 1 nsec to about 10 msec, wherein each pulse is configured to micro-anneal; and a detector comprising a laser configured to deliver low-energy electromagnetic radiation and disposed to direct electromagnetic energy toward the substrate support, and a photoacoustic detector disposed to receive reflected electromagnetic energy. 2. The apparatus of claim 1 , wherein the switch is an electrical switch. 3. The apparatus of claim 1 , wherein the optical assembly combines the received pulses of electromagnetic radiation to form the temporally shaped pulses of electromagnetic radiation. 4. The apparatus of claim 1 , further comprising a substrate having a plurality of dies configured to form anneal regions upon annealing, wherein the boundary of each anneal regions has a boundary defined by kerf lines, wherein each of the anneal regions is a rectangular region having a size of about 22 mm by about 33 mm. 5. The apparatus of claim 4 , further comprising a second laser source disposed on an opposite side of the substrate from the first laser source.
Thermal treatments, e.g. annealing or sintering · CPC title
mainly by radiation · CPC title
with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title
by ion implantation · CPC title
being group IV material · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.