Wafer producing method

Patent metadata

Field	Value
Publication number	US-9764420-B2
Application number	US-201514955352-A
Country	US
Kind code	B2
Filing date	Dec 1, 2015
Priority date	Dec 4, 2014
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A wafer producing method for producing a hexagonal single crystal wafer from a hexagonal single crystal ingot is disclosed. The wafer producing method includes a separation start point forming step of forming a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer to thereby form a separation start point in the ingot. The separation start point forming step includes a first separation start point forming step of setting the focal point of a laser beam at a first depth which is N times (N is an integer not less than 2) the depth corresponding to the thickness of the wafer from the upper surface of the ingot and next applying the laser beam to the ingot to thereby form a first separation start point composed of a first modified layer and first cracks extending therefrom.

First claim

What is claimed is:

1. A wafer producing method for producing a hexagonal single crystal wafer from a hexagonal single crystal ingot having a first surface, a second surface opposite to the first surface, a c-axis extending from the first surface to the second surface, and a c-plane perpendicular to the c-axis, the wafer producing method comprising:
a separation start point forming step of setting a focal point of a laser beam having a transmission wavelength to the ingot inside the ingot at a predetermined depth from the first surface, which depth corresponds to a thickness of the wafer to be produced, and next applying the laser beam to the first surface as relatively moving the focal point and the ingot to thereby form a modified layer parallel to the first surface and cracks extending from the modified layer along the c-plane, thus forming a separation start point; and
a wafer separating step of separating a plate-shaped member having a thickness corresponding to the thickness of the wafer from the ingot at the separation start point after performing the separation start point forming step, thus producing the wafer from ingot;
the separation start point forming step including
a modified layer forming step of relatively moving the focal point of the laser beam in a first direction perpendicular to a second direction where the c-axis is inclined by an off angle with respect to a normal to the first surface and the off angle is formed between the first surface and the c-plane, thereby linearly forming the modified layer extending in the first direction, and
an indexing step of relatively moving the focal point in the second direction to thereby index the focal point by a predetermined amount;

the modified layer forming step including
a first separation start point forming step of setting the focal point of the laser beam at a first depth which is N times (N is an integer not less than 2) the depth corresponding to the thickness of the wafer from the first surface of the ingot and next applying the laser beam to the first surface of the ingot to thereby form a first separation start point composed of a first modified layer and first cracks extending therefrom, and
a second separation start point forming step of setting the focal point of the laser beam at a second depth obtained by subtracting the depth corresponding to the thickness of the wafer from the first depth of the first separation start point toward the first surface of the ingot and next applying the laser beam to the first surface of the ingot to thereby form a second separation start point composed of a second modified layer and second cracks extending therefrom, after performing the first separation start point forming step.

2. The wafer producing method according to claim 1 , wherein the hexagonal single crystal ingot is selected from an SiC single crystal ingot and a GaN single crystal ingot.

Assignees

• Disco Corp

Inventors

• Hirata Kazuya
• Takahashi Kunimitsu
• Nishino Yoko

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B28D5/0011 Primary

  with preliminary treatment, e.g. weakening by scoring · CPC title

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

• B23K26/0057 Primary

  Operations & Transport · mapped topic

• B23K26/53 Primary

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title