Semiconductor device package including bonding layer having Ag3Sn
US-9520377-B2 · Dec 13, 2016 · US
without ferrous layer
without ferrous layer · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K20/233 |
| Official title | without ferrous layer |
| Display label | without ferrous layer |
| Total patents | 442 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 33 |
| 2016 | 39 |
| 2017 | 47 |
| 2018 | 38 |
| 2019 | 47 |
| 2020 | 45 |
| 2021 | 33 |
| 2022 | 46 |
| 2023 | 51 |
| 2024 | 38 |
| 2025 | 23 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Shanks and methods for forming such shanks
US-2016356305-A1 · Dec 8, 2016 · US
Wire bonding method
US-9508673-B2 · Nov 29, 2016 · US
Wire bond strengthening
US-2016322329-A1 · Nov 3, 2016 · US
Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
US-2016315064-A1 · Oct 27, 2016 · US
Manufacture of a hollow aerofoil
US-2016311052-A1 · Oct 27, 2016 · US
Repair method and repair material
US-2016288245-A1 · Oct 6, 2016 · US
Integrate rinse module in hybrid bonding platform
US-9446467-B2 · Sep 20, 2016 · US
Wire bonding method
US-2016247777-A1 · Aug 25, 2016 · US
Systems of bonded substrates
US-9418959-B1 · Aug 16, 2016 · US
Golf club face plates with internal cell lattices and related methods
US-9409065-B2 · Aug 9, 2016 · US
Chromatography apparatus having diffusion-bonded and surface-modified components
US-9409252-B2 · Aug 9, 2016 · US
Friction Stir Welding Method and Friction Stir Welding Apparatus
US-2016167163-A1 · Jun 16, 2016 · US
Wire bonding method and chip structure
US-9362254-B1 · Jun 7, 2016 · US
Transient liquid phase bonding of surface coatings metal-covered materials
US-2016151856-A1 · Jun 2, 2016 · US
Bonding apparatus and method for display device
US-9351435-B2 · May 24, 2016 · US
Electrical connector for a battery module
US-2016141585-A1 · May 19, 2016 · US
Joined product
US-9308707-B2 · Apr 12, 2016 · US
Nano-grained multilayer copper alloy sheet having high strength and high electrical conductivity, and method for manufacturing same
US-9296064-B2 · Mar 29, 2016 · US
Sn—Sb—Ni ternary compound and method for forming the same
US-9299983-B2 · Mar 29, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K20/233?
- CPC B23K20/233 is the Cooperative Patent Classification code for “without ferrous layer.”
- How many patents are filed under CPC B23K20/233 (without ferrous layer)?
- Our database includes 442 publications tagged with this CPC code.
- Is patent activity under CPC B23K20/233 growing?
- Publication counts under this code: 38 in 2024 vs 23 in 2025 (latest complete years).