Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding

Patent metadata

Field	Value
Publication number	US-2016315064-A1
Application number	US-201615131610-A
Country	US
Kind code	A1
Filing date	Apr 18, 2016
Priority date	Apr 24, 2015
Publication date	Oct 27, 2016
Grant date	—

Abstract

A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.

First claim

What is claimed:

1 . A method of operating a thermocompression bonding system, the method comprising the steps of:
bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.

2 . The method of claim 1 wherein the step of moving includes moving the semiconductor element using a motion system adapted to move a bonding tool carrying the semiconductor element.

3 . The method of claim 2 wherein the motion system includes a servo controlled linear motion system.

4 . The method of claim 1 wherein the step of moving includes moving the substrate using a motion system adapted to move a support structure supporting the substrate.

5 . The method of claim 4 wherein the motion system includes a servo controlled linear motion system.

6 . The method of claim 1 wherein the step of moving includes moving the semiconductor element relative to the substrate along a plurality of substantially horizontal directions.

7 . The method of claim 6 wherein movement along at least one of the plurality of substantially horizontal directions is provided using a motion system adapted to move a bonding tool carrying the semiconductor element.

8 . The method of claim 6 wherein movement along at least one of the plurality of substantially horizontal directions is provided using a motion system adapted to move a support structure supporting the substrate.

9 . The method of claim 6 wherein movement along at least one of the plurality of substantially horizontal directions is provided using a motion system adapted to move a bonding tool carrying the semiconductor element, and wherein movement along at least one of the plurality of substantially horizontal directions is provided using a motion system adapted to move a support structure supporting the substrate.

10 . The method of claim 1 wherein the step of moving is commenced after bringing first conductive structures of the semiconductor element into contact with second conductive structures of the substrate.

11 . The method of claim 1 wherein the step of moving is commenced before bringing first conductive structures of the semiconductor element into contact with second conductive structures of the substrate.

12 . The method of claim 1 wherein the at least one substantially horizontal direction includes a linear direction.

13 . The method of claim 1 wherein the at least one substantially horizontal direction includes a non-linear direction.

14 . The method of claim 1 wherein the step of moving the semiconductor element relative to the substrate includes low frequency relative movement.

15 . The method of claim 1 wherein the relative motion between the semiconductor element and the substrate varies as a function of time.

16 . The method of claim 1 wherein the relative motion between the semiconductor element and the substrate varies as a function of a z-height of a bonding tool for bonding the semiconductor element to the substrate.

17 . The method of claim 1 wherein the relative motion between the semiconductor element and the substrate varies as a function of a bond force applied by a bonding tool for bonding the semiconductor element to the substrate.

18 . The method of claim 1 wherein the relative motion between the semiconductor element and the substrate varies as a function of a temperature measured from at least one location of a bond head assembly including a bonding tool for bonding the semiconductor element to the substrate.

19 . The method of claim 1 wherein the relative motion between the semiconductor element and the substrate varies as a function of at least one of (1) time, (2) a z-height of a bonding tool for bonding the semiconductor element to the substrate, (3) a bond force applied by the bonding tool, and (4) a temperature measured from at least one location of a bond head assembly including the bonding tool.

20 . The method of claim 1 wherein the step of moving the semiconductor element relative to the substrate includes using a motion system included in a lower bond head assembly carrying the bonding tool to provide the relative movement.

21 . The method of claim 20 wherein the motion system included in the lower bond head assembly includes a piezo actuator.

22 . A thermocompression bonder comprising:
a support structure for supporting a substrate; a bonding tool for bonding a semiconductor element to the substrate; and a motion system configured to provide relative movement between the semiconductor element and the substrate during a thermocompression bonding operation.

23 . The thermocompression bonder of claim 22 wherein the motion system is included in a lower bond head of the thermocompression bonder.

24 . The thermocompression bonder of claim 22 wherein the motion system includes a piezo actuator.

Assignees

• Kulicke & Soffa Ind Inc

Inventors

• Clauberg Horst
• Colosimo Jr Thomas J

Classifications

• B23K20/16

  with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas · CPC title

• B23K2101/38

  Conductors · CPC title

• B23K20/026

  with diffusion of soldering material · CPC title

• B23K2101/42

  Printed circuits · CPC title

• B23K20/002 Primary

  specially adapted for particular articles or work (B23K20/129 takes precedence) · CPC title