Systems of bonded substrates

Patent metadata

Field	Value
Publication number	US-9418959-B1
Application number	US-201514794286-A
Country	US
Kind code	B1
Filing date	Jul 8, 2015
Priority date	Jul 8, 2015
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

A system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer. The first substrate may include a bonding surface and the second substrate may include a complementary bonding surface. The composite bonding layer may be positioned between the first substrate and the second substrate. The composite boding layer may include a metal matrix and a plurality of stress-reducing additives disposed in the metal matrix. Each stress-reducing additive may include a three-dimensional shape The stress-reducing additives may include a ratio of length:height of at least about 2:1. An elastic modulus of a material of the stress-reducing additive may be less than an elastic modulus of the material of the metal matrix.

First claim

What is claimed is:

1. A system of bonded substrates, the system comprising:
a first substrate comprising a bonding surface;
a second substrate comprising a complementary bonding surface; and
a composite bonding layer positioned between the first substrate and the second substrate and in contact with the bonding surface of the first substrate and the complementary bonding surface of the second substrate, wherein the composite bonding layer comprises:
a metal matrix; and
a plurality of stress-reducing additives disposed in the metal matrix, each stress-reducing additive comprising a three-dimensional shape comprising a height in a direction substantially perpendicular to the bonding surface of the first substrate, a length in a direction substantially parallel to the bonding surface of the first substrate, and a width in a direction substantially parallel to the bonding surface of the first substrate, wherein the stress-reducing additives comprise a ratio of length:height of at least about 2:1, and an elastic modulus of a material of the stress-reducing additive is less than an elastic modulus of the material of the metal matrix.

2. The system of claim 1 , wherein the metal matrix consists essentially of one or more metals chosen from tin, nickel, copper, silver, aluminum, or combinations thereof.

3. The system of claim 1 , wherein the elastic modulus of the material of the metal matrix is at least about 50% greater than the elastic modulus of the material of the stress-reducing additives.

4. The system of claim 1 , wherein the stress-reducing additives comprises at least about 90 wt % of one or more polymers.

5. The system of claim 1 , wherein the material of the stress-reducing additives has an elastic modulus of less than or equal to about 40 GPa.

6. The system of claim 1 , wherein the stress-reducing additives are substantially disk shaped or are substantially oblong shaped.

7. The system of claim 1 , wherein the stress-reducing additives comprise a ratio of length:width of from about 2:1 to about 1:2.

8. The system of claim 1 , wherein the stress-reducing additives comprise a ratio of length:width of at least about 3:1.

9. The system of claim 1 , wherein:
the bonding surface of the first substrate is substantially planar;
the complementary bonding surface of the second substrate is substantially planar; and
the bonding surface of the first substrate is substantially parallel to the complementary bonding surface of the second substrate.

10. A system of bonded substrates, the system comprising:
a first substrate comprising a bonding surface;
a second substrate comprising a complementary bonding surface; and
a composite bonding layer positioned between the first substrate and the second substrate and in contact with the bonding surface of the first substrate and the complementary bonding surface of the second substrate, wherein the composite bonding layer comprises:
a metal matrix; and
a plurality of stress-reducing additives disposed in the metal matrix, each stress-reducing additive comprising a three-dimensional shape comprising a height in a direction substantially perpendicular to the bonding surface of the first substrate, a length in a direction substantially parallel to the bonding surface of the first substrate, and a width in a direction substantially parallel to the bonding surface of the first substrate, wherein the stress-reducing additives comprise a ratio of height:length of at least about 5:1 and a ratio of height:width of at least about 5:1, and an elastic modulus of a material of the stress-reducing additive is less than an elastic modulus of the material of the metal matrix.

11. The system of claim 10 , wherein the metal matrix consists essentially of one or more metals chosen from tin, nickel, copper, silver, aluminum, or combinations thereof.

12. The system of claim 10 , wherein the elastic modulus of the material of the metal matrix is at least about 50% greater, than the elastic modulus of the material of the stress-reducing additives.

13. The system of claim 10 , wherein the stress-reducing additives comprises at least about 90 wt % of one or more polymers.

14. The system of claim 10 , wherein the material of the stress-reducing additives has an elastic modulus of less than or equal to about 40 GPa.

15. The system of claim 10 , wherein the stress-reducing additives are substantially rod shaped.

16. The system of claim 10 , wherein the height of the stress-reducing additives is about equal to a thickness of the composite bonding layer.

17. The system of claim 10 , wherein the stress-reducing additives comprise a ratio of height:length of at least about 10:1 and a ratio of height:width of at least about 10:1.

18. The system of claim 10 , wherein:
the bonding surface of the first substrate is substantially planar;
the complementary bonding surface of the second substrate is substantially planar; and
the bonding surface of the first substrate is substantially parallel to the complementary bonding surface of the second substrate.

19. A composite bonding layer positioned between a first substrate and a second substrate, the composite bonding layer comprising:
a metal matrix; and
a plurality of stress-reducing additives disposed in the metal matrix, each stress-reducing additive comprising a three-dimensional shape comprising a height in a direction substantially perpendicular to the bonding surface of the first substrate, a length in a direction substantially parallel to the bonding surface of the first substrate, and a width in a direction substantially parallel to the bonding surface of the first substrate, wherein the stress-reducing additives comprise a ratio of length:height of at least about 2:1, and an elastic modulus of a material of the stress-reducing additive is less than an elastic modulus of the material of the metal matrix.

20. The system of claim 19 , wherein the metal matrix consists essentially of one or more metals chosen from tin, nickel, copper, silver, aluminum, or combinations thereof.

Assignees

• Toyota Motor Eng & Mfg North America Inc

Inventors

• Joshi Shailesh N
• Noguchi Masao

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title