Forming a Casing of an Electronics Device
US-2016339537-A1 · Nov 24, 2016 · US
with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K20/16 |
| Official title | with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas |
| Display label | with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas |
| Total patents | 322 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 44 |
| 2016 | 33 |
| 2017 | 41 |
| 2018 | 37 |
| 2019 | 27 |
| 2020 | 32 |
| 2021 | 31 |
| 2022 | 21 |
| 2023 | 21 |
| 2024 | 26 |
| 2025 | 6 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of joining two materials by diffusion welding
US-2016318118-A1 · Nov 3, 2016 · US
Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
US-2016315064-A1 · Oct 27, 2016 · US
Power module substrate, power module substrate with heat sink, and power module
US-9480144-B2 · Oct 25, 2016 · US
Repair method and repair material
US-2016288245-A1 · Oct 6, 2016 · US
Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit
US-9449948-B2 · Sep 20, 2016 · US
Semiconductor device with mechanical lock features between a semiconductor die and a substrate
US-9425161-B2 · Aug 23, 2016 · US
Method for joining dissimilar engine components
US-2016236992-A1 · Aug 18, 2016 · US
Plate heat exchanger
US-2016202005-A1 · Jul 14, 2016 · US
Joined product
US-9308707-B2 · Apr 12, 2016 · US
Joined body and method for producing the same
US-2016046531-A1 · Feb 18, 2016 · US
Bonding body, power module substrate, and heat-sink-attached power module substrate
US-2016035660-A1 · Feb 4, 2016 · US
Transient liquid pahse bonded turbine rotor assembly
US-2016024944-A1 · Jan 28, 2016 · US
Composite airfoil bonded to a metallic root
US-2016010658-A1 · Jan 14, 2016 · US
Current schedule for optimized reaction metallurgical joining
US-2016008912-A1 · Jan 14, 2016 · US
Joined body and method for producing the same
US-2016002110-A1 · Jan 7, 2016 · US
Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method
US-9221130-B2 · Dec 29, 2015 · US
Microelectromechanical system and method for manufacturing a microelectromechanical system
US-2015360934-A1 · Dec 17, 2015 · US
Fixture for high temperature joining
US-2015343547-A1 · Dec 3, 2015 · US
Conical pins for the structural repair of defects
US-2015328725-A1 · Nov 19, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K20/16?
- CPC B23K20/16 is the Cooperative Patent Classification code for “with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas.”
- How many patents are filed under CPC B23K20/16 (with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas)?
- Our database includes 322 publications tagged with this CPC code.
- Is patent activity under CPC B23K20/16 growing?
- Publication counts under this code: 26 in 2024 vs 6 in 2025 (latest complete years).