Forming a Casing of an Electronics Device

Patent metadata

Field	Value
Publication number	US-2016339537-A1
Application number	US-201415111533-A
Country	US
Kind code	A1
Filing date	Feb 12, 2014
Priority date	Feb 12, 2014
Publication date	Nov 24, 2016
Grant date	—

Abstract

A method of forming a casing of an electronic device is described in which heat and pressure are applied to a metal substrate and a metal layer in a molding device. The metal substrate and the metal layer are molded into a shape of the casing. At the same time, an intermediate phase between the metal substrate and the metal layer is formed by inter-diffusion bonding.

First claim

1 . A method of forming a casing of an electronics device, the method comprising
applying pressure and heat to a metal substrate and a metal layer in a molding device to form an intermediate phase between the distal substrate and the metal layer by inter-diffusion bonding and to shape the metal substrate and the metal layer into the casing.

2 . The method according to claim 1 , wherein the metal substrate is one of magnesium and magnesium alloy.

3 . The method according to claim 1 , wherein the metal layer is one of aluminium, an aluminum alloy and a magnesium-aluminium-zinc alloy.

4 . The method according to claim 1 , wherein the method further comprises, after applying pressure and heat, performing a surface treatment of the metal layer.

5 . A casing for an electronics device, the casing comprising
a metal substrate in the shape of the casing, a metal layer, and an intermediate phase formed by inter-diffusional bonding between the metal substrate and the metal layer.

6 . The casing according to claim 5 , wherein the metal substrate is a magnesium-lithium alloy

7 . The casing according to claim 5 , wherein the metal layer is a magnesium-aluminium-zinc alloy.

8 . The casing according to claim 5 , wherein the metal substrate has a thickness of 0.5-5 mm.

9 . The casing according to claim 5 , wherein the metal layer has a thickness of 0.1-3 mm.

10 . The casing according to claim 5 , wherein the intermediate phase has a thickness of 3-10 μm.

10 . A method of molding and coating a casing for an electron ids device, the method comprising
placing a metal substrate and a coat metal layer between a core mold part and a cavity mold part, and applying pressure and heat to the core mold part and cavity mold part, such that an intermediate phase is formed by inter-diffusional bonding at points of contact between the metal substrate and the coat metal layer.

11 . The method according to claim 10 , wherein the metal substrate is a magnesium-lithium alloy.

12 . The method according to claim 10 , wherein the core and cavity molds have internal surfaces shaped to define the shape of the casing.

13 . The method according to claim 12 , wherein the internal surfaces of the core and cavity molds include protrusions and/or depressions to provide respective depressions and/or protrusions on the casing.

14 . The method according to claim 10 , wherein the method further comprises, after applying pressure and heat, performing a surface treatment of the metal layer.

15 . The method according to claim 10 , wherein the electronics device is a phone, tablet, portable computer or other electronics device.

Assignees

• Hewlett Packard Development Co Lp

Inventors

• Wu Kuan-Ting
• Kang Yu-Chuan

Classifications

• B21D51/16

  characterised by the use of the objects (making heat exchangers B21D53/02) · CPC title

• B23K2103/15

  Magnesium or alloys thereof · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title

• B23K20/023 Primary

  Thermo-compression bonding · CPC title

• B23K2103/10

  Aluminium or alloys thereof · CPC title