Breaking-in and cleaning method and apparatus for wafer-cleaning brush
US-2024066566-A1 · Feb 29, 2024 · US
using fluids
using fluids · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B08B1/52 |
| Official title | using fluids |
| Display label | using fluids |
| Total patents | 123 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 4 |
| 2017 | 6 |
| 2018 | 9 |
| 2019 | 5 |
| 2020 | 17 |
| 2021 | 12 |
| 2022 | 13 |
| 2023 | 11 |
| 2024 | 15 |
| 2025 | 24 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate cleaning apparatus, polishing apparatus, buffing apparatus, substrate cleaning method, substrate processing apparatus, and machine learning apparatus
US-2022410343-A1 · Dec 29, 2022 · US
Substrate cleaning device
US-11517940-B2 · Dec 6, 2022 · US
Compositions and methods for reducing interaction between abrasive particles and a cleaning brush
US-11446708-B2 · Sep 20, 2022 · US
System for cleaning semiconductor wafers
US-2021402444-A1 · Dec 30, 2021 · US
Method for determining cleanliness of cleaning member, method for determining adsorption characteristics of contaminants that contaminate cleaning member, method for determining cleanliness of substrate, program for determining cleanliness of substrate, and program for determining end point of cleaning process
US-2021384881-A1 · Dec 9, 2021 · US
System for cleaning semiconductor wafers
US-11141762-B2 · Oct 12, 2021 · US
Coating Machine, Coating System and Cleaning Method for Coating Machine
US-2021308729-A1 · Oct 7, 2021 · US
Working machine
US-2021292980-A1 · Sep 23, 2021 · US
Application of cleaning solution on a surface maintenance machine
US-2021282616-A1 · Sep 16, 2021 · US
Semiconductor wafer cleaning apparatus
US-2021233766-A1 · Jul 29, 2021 · US
Semiconductor wafer cleaning apparatus
US-10991570-B2 · Apr 27, 2021 · US
Cleaning device for hemming roller
US-2021094078-A1 · Apr 1, 2021 · US
System for cleaning wafer in cmp process of semiconductor manufacturing fabrication
US-2021060624-A1 · Mar 4, 2021 · US
Substrate cleaning apparatus and substrate cleaning method
US-2021039142-A1 · Feb 11, 2021 · US
Substrate cleaning brush and substrate cleaning apparatus
US-10892174-B2 · Jan 12, 2021 · US
Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus
US-10879086-B2 · Dec 29, 2020 · US
System for cleaning wafer in CMP process of semiconductor manufacturing fabrication
US-10864557-B2 · Dec 15, 2020 · US
Substrate treatment apparatus
US-10821483-B2 · Nov 3, 2020 · US
Cleaning system for a polishing film
US-10814356-B2 · Oct 27, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B08B1/52?
- CPC B08B1/52 is the Cooperative Patent Classification code for “using fluids.”
- How many patents are filed under CPC B08B1/52 (using fluids)?
- Our database includes 123 publications tagged with this CPC code.
- Is patent activity under CPC B08B1/52 growing?
- Publication counts under this code: 15 in 2024 vs 24 in 2025 (latest complete years).