Integrated circuit device including through-silicon via structure and method of manufacturing the same
US-10128168-B2 · Nov 13, 2018 · US
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Park Byung Lyul patents
Park Byung Lyul holds 12 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 12 |
| Recent patents | 0 |
| First publication | Oct 6, 2015 |
| Latest publication | Nov 13, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Method of manufacturing semiconductor package
US-9922897-B1 · Mar 20, 2018 · US
Semiconductor device including conductive via with buffer layer at tapered portion of conductive via
US-9859191-B2 · Jan 2, 2018 · US
Semiconductor devices with through electrodes and methods of fabricating the same
US-9852965-B2 · Dec 26, 2017 · US
Semiconductor devices having through-electrodes and methods for fabricating the same
US-9847276-B2 · Dec 19, 2017 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Integrated circuit device including through-silicon via structure and method of manufacturing the same
US-10128168-B2 · Nov 13, 2018 · US
Method of manufacturing semiconductor package
US-9922897-B1 · Mar 20, 2018 · US
Semiconductor device including conductive via with buffer layer at tapered portion of conductive via
US-9859191-B2 · Jan 2, 2018 · US
Semiconductor devices with through electrodes and methods of fabricating the same
US-9852965-B2 · Dec 26, 2017 · US
Semiconductor devices having through-electrodes and methods for fabricating the same
US-9847276-B2 · Dec 19, 2017 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W20/20 | 11 |
| H01L23/481 | 11 |
| H10W20/023 | 10 |
| H01L21/76898 | 10 |
| H10W20/2134 | 8 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 12 |
| Cross-Sectional Technologies | 1 |