Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

Patent metadata

Field	Value
Publication number	US-9330993-B2
Application number	US-201213721266-A
Country	US
Kind code	B2
Filing date	Dec 20, 2012
Priority date	Dec 20, 2012
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

First claim

What is claimed is:

1. A package structure comprising:
an underfill material disposed on conductive bumps of the package structure, wherein the underfill material comprises a filler having a modified surface comprising one of a thiol based adhesion promoter having a molecular weight above about 150 g/mol or an azole based coupling agent, wherein the modified surface of the filler bonds the filler to the conductive bumps.

2. The package structure of claim 1 further comprising wherein the thiol based adhesion promoter comprises a silane.

3. The package structure of claim 2 further comprising wherein the silane comprises a mercaptosilane comprising carbonyl groups, wherein the carbonyl groups comprise electron withdrawing groups that are capable of removing electrons from the conductive bumps.

4. The package structure of claim 1 further comprising wherein the azole based coupling agent comprises at least one of benzotriazole, benzotriazole-5-carboxylic acid, imidazole, 8-azadenine, heterocyclic compounds comprising at least one of nitrogen or sulfur, polybenzimidazole, polybenzoxazole (PBO), or polybenzthiazole (PBT).

5. The package structure of claim 1 further comprising wherein the underfill material comprises a peroxide cross linking chemistry.

6. The structure of claim 1 further comprising wherein the conductive bumps comprise copper.

7. The structure of claim 1 further comprising wherein the underfill material comprises at least one of epoxy, cyanoacrylate, polyurethane, phenolics, or polyolefins.

8. A package structure comprising:
a package substrate;
a die disposed on the package substrate, wherein conductive bumps couple the die to the package substrate; and
an underfill material disposed on conductive bumps and between the device and the package substrate, wherein the underfill material comprises a filler having a modified surface comprising one of a thiol based adhesion promoter having a molecular weight above 150 g/mol or an azole based coupling agent, wherein the modified surface of the filler bonds the filler to the conductive bumps.

9. The structure of claim 8 wherein the package structure further comprises at least one of a CPU or a memory die.

10. The structure of claim 8 further comprising:
a bus communicatively coupled to the package structure; and
an eDRAM communicatively coupled to the bus.

11. A package structure comprising:
an underfill material disposed on conductive bumps of the package structure, wherein the underfill material comprises a filler having a modified surface comprising a thiol based adhesion promoter having a molecular weight above 150 g/mol, and a triazole based coupling agent, wherein the modified surface of the filler bonds the filler to the conductive bumps.

12. The package structure of claim 11 further comprising wherein the thiol based adhesion promoter comprises a silane.

13. The package structure of claim 12 further comprising wherein the silane comprises a mercaptosilane comprising carbonyl groups, wherein the carbonyl groups comprise electron withdrawing groups that are capable of removing electrons from the conductive bumps.

14. The package structure of claim 11 further comprising wherein the triazole based coupling agent is selected from the group consisting of benzotriazole and benzotriazole-5-carboxylic acid.

15. The package structure of claim 11 further comprising wherein the underfill material comprises a peroxide cross linking chemistry.

16. The structure of claim 11 further comprising wherein the conductive bumps comprise copper.

17. The structure of claim 11 further comprising wherein the underfill material comprises at least one of epoxy, cyanoacrylate, polyurethane, phenolics, or polyolefins.

18. A package structure comprising:
a package substrate;
a die disposed on the package substrate, wherein conductive bumps couple the die to the package substrate; and
an underfill material disposed on the conductive bumps in between the die and the package substrate wherein the underfill material comprises a filler having a modified surface comprising a thiol based adhesion promoter having a molecular weight above 150 g/mol and a triazole based coupling agent, wherein the modified surface of the filler bonds the filler to the conductive bumps.

19. The structure of claim 18 wherein the package structure further comprises at least one of a CPU or a memory die.

20. The structure of claim 18 further comprising:
a bus communicatively coupled to the package structure; and
an eDRAM communicatively coupled to the bus.

Assignees

• Bai Yiqun
• Wei Yuying
• Krishnan Arjun
• Ramalingam Suriyakala
• Xiu Yonghao
• Canham Beverly J
• Nagarajan Sivakumar
• Jayaraman Saikumar
• Ananthakrishnan Nisha
• Intel Corp

Inventors

• Bai Yiqun
• Wei Yuying
• Krishnan Arjun
• Ramalingam Suriyakala
• Xiu Yonghao
• Canham Beverly J
• Nagarajan Sivakumar
• Jayaraman Saikumar
• Ananthakrishnan Nisha

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/355

  of outermost layers of multilayered die-attach connectors, e.g. material of a coating · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title