Thermoset polymides for microelectronic applications

Patent metadata

Field	Value
Publication number	US-9646903-B2
Application number	US-201414171707-A
Country	US
Kind code	B2
Filing date	Feb 3, 2014
Priority date	May 12, 2006
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

First claim

The invention claimed is:

1. A non-conductive thermal interface material for coupling between a substrate and a chip comprising:
a formulation resulting from a cross-linking reaction of a dendrimer or a hyperbranched polymer with a thermoset polyimide; or
a polyimide resulting from a cross-linking reaction of bis-norbornene monomers, the cross-linking reaction involving ring opening metathesis polymerization (ROMP) and catalyzed by a transition metal, wherein each of the bis-norbornene monomers comprises a rigid aromatic moiety and two norbornene rings directly connected to the rigid aromatic moiety, the rigid aromatic moiety comprising a bisimide, wherein the two imide groups of the bisimide are attached to a same single ring.

2. The material as in claim 1 wherein the thermoset polyimide cross-links by an olefin metathesis polymerization.

3. The material of claim 1 wherein the dendrimer or the hyperbranched polymer comprises a polyphenylene and an aromatic structure, the aromatic structure selected from the group consisting of an aromatic polyamide and a polyester.

4. The material as in claim 1 , wherein each of the bis-norbornene monomers has the following chemical structure:

5. A non-conductive thermal interface material for coupling between a substrate and a chip comprising:
a formulation resulting from a cross-linking reaction of a dendrimer or a hyperbranched polymer with a thermoset polyimide; or
a polyimide resulting from a cross-linking reaction of bis-norbornene monomers, the cross-linking reaction involving ring opening metathesis polymerization (ROMP) and catalyzed by a transition metal, wherein each of the bis-norbornene monomers has a chemical structure selected from the group consisting of:

6. The material as in claim 5 , wherein the thermoset polyimide cross-links by an olefin metathesis polymerization.

7. The material of claim 5 , wherein the dendrimer or the hyperbranched polymer comprises a polyphenylene and an aromatic structure, the aromatic structure selected from the group consisting of an aromatic polyamide and a polyester.

Assignees

• Matayabas Jr James C
• Jayaraman Saikumar
• Intel Corp

Inventors

• Lehman Jr Stephen E
• Matayabas Jr James C
• Jayaraman Saikumar

Classifications

• C08L2205/02

  containing two or more polymers of the same C08L -group · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title

• C08L79/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08G73/10

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title