Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US-10163658-B2 · Dec 25, 2018 · US
This page is not indexed by search engines while we improve data quality.
Utac Headquarters Pte Ltd patents in 2018
Utac Headquarters Pte Ltd was listed as an assignee on 15 patent publications in 2018.
| Metric | Value |
|---|---|
| Company | Utac Headquarters Pte Ltd |
| Year | 2018 |
| Patents | 15 |
Patents
Representative publications for Utac Headquarters Pte Ltd in 2018.
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US-10163658-B2 · Dec 25, 2018 · US
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US-10096490-B2 · Oct 9, 2018 · US
Semiconductor packages and methods of packaging semiconductor devices
US-2018240726-A1 · Aug 23, 2018 · US
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US-10032645-B1 · Jul 24, 2018 · US
Top CPC classifications
Most common classification codes for Utac Headquarters Pte Ltd in 2018.
| CPC | Patents |
|---|---|
| H10W72/0198 | 12 |
| H10W74/014 | 12 |
| H10W74/129 | 12 |
| H10W90/754 | 12 |
| H10W72/5522 | 11 |
Related pages
Navigate to parent entity pages.