Semiconductor device including conductive via with buffer layer at tapered portion of conductive via
US-9859191-B2 · Jan 2, 2018 · US
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An Jin Ho patents
An Jin Ho holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | May 16, 2017 |
| Latest publication | Jan 2, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Semiconductor devices with through electrodes and methods of fabricating the same
US-9852965-B2 · Dec 26, 2017 · US
Semiconductor devices having through-electrodes and methods for fabricating the same
US-9847276-B2 · Dec 19, 2017 · US
Semiconductor devices having stacked structures and methods for fabricating the same
US-9653430-B2 · May 16, 2017 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Semiconductor device including conductive via with buffer layer at tapered portion of conductive via
US-9859191-B2 · Jan 2, 2018 · US
Semiconductor devices with through electrodes and methods of fabricating the same
US-9852965-B2 · Dec 26, 2017 · US
Semiconductor devices having through-electrodes and methods for fabricating the same
US-9847276-B2 · Dec 19, 2017 · US
Semiconductor devices having stacked structures and methods for fabricating the same
US-9653430-B2 · May 16, 2017 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |
| Cross-Sectional Technologies | 1 |