Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint
US-9558965-B2 · Jan 31, 2017 · US
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Shin Hangil patents
Shin Hangil holds 10 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 10 |
| Recent patents | 0 |
| First publication | Feb 10, 2015 |
| Latest publication | Jan 31, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Carrier system with multi-tier conductive posts and method of manufacture thereof
US-9496152-B2 · Nov 15, 2016 · US
Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant
US-9397050-B2 · Jul 19, 2016 · US
Integrated circuit package stacking system with shielding and method of manufacture thereof
US-9355939-B2 · May 31, 2016 · US
Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die
US-9312218-B2 · Apr 12, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint
US-9558965-B2 · Jan 31, 2017 · US
Carrier system with multi-tier conductive posts and method of manufacture thereof
US-9496152-B2 · Nov 15, 2016 · US
Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant
US-9397050-B2 · Jul 19, 2016 · US
Integrated circuit package stacking system with shielding and method of manufacture thereof
US-9355939-B2 · May 31, 2016 · US
Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die
US-9312218-B2 · Apr 12, 2016 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 10 |
| Cross-Sectional Technologies | 1 |