Carrier system with multi-tier conductive posts and method of manufacture thereof

Patent metadata

Field	Value
Publication number	US-9496152-B2
Application number	US-72285210-A
Country	US
Kind code	B2
Filing date	Mar 12, 2010
Priority date	Mar 12, 2010
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A method of manufacture of a carrier system includes: providing a carrier base; forming a recess in the carrier base with the recess around a planar surface; forming a first barrier on the planar surface; forming a second barrier on the carrier base in the recess; forming a first post on the first barrier; and forming a second post on the second barrier.

First claim

What is claimed is:

1. A method of manufacture of a carrier system comprising:
providing a carrier base, the carrier base formed from a metallic material;
forming a recess in the carrier base with the recess around a planar surface;
forming a first barrier on and protruding from the planar surface;
forming a second barrier on the carrier base in the recess;
forming a first post on the first barrier; and
forming a second post on the second barrier.

2. The method as claimed in claim 1 further comprising:
forming a contact pad on the planar surface; and

wherein:
forming the first post includes forming the first post adjacent to the contact pad.

3. The method as claimed in claim 1 further comprising:
forming a conductive structure on the planar surface; and

wherein:
forming the first post includes forming the first post on the conductive structure and not covering the entire surface of the conductive structure.

4. The method as claimed in claim 1 wherein forming the first post includes forming the first post perpendicular to the carrier base.

5. The method as claimed in claim 1 wherein forming the second post includes forming the second post perpendicular to the carrier base.

6. A method of manufacture of a carrier system comprising:
providing a carrier base, the carrier base formed from a metallic material;
forming a recess, having a recess bottom and a recess slope, in the carrier base with the recess around a planar surface;
forming a first barrier on and protruding from the planar surface;
forming a second barrier on the carrier base at the recess bottom;
forming a first post on the first barrier; and
forming a second post on the second barrier.

7. The method as claimed in claim 6 wherein forming the second post includes forming the second post co-planar with the first post.

8. The method as claimed in claim 6 wherein forming the recess includes forming the recess bottom parallel to the planar surface.

9. The method as claimed in claim 6 wherein forming the recess includes forming the recess having the recess slope at an obtuse angle with the recess bottom.

10. The method as claimed in claim 6 wherein forming the first barrier includes forming an etch protection layer.

11. A carrier system comprising:
a carrier base having a recess around a planar surface, the carrier base formed from a metallic material;
a first barrier on and protruding from the planar surface;
a second barrier on the carrier base in the recess;
a first post on the first barrier; and
a second post on the second barrier.

12. The system as claimed in claim 11 further comprising:
a contact pad on the planar surface; and

wherein:
the first post is adjacent to the contact pad.

13. The system as claimed in claim 11 further comprising:
a conductive structure on the planar surface; and

wherein:
the first post is on the conductive structure and not covering the entire surface of the conductive structure.

14. The system as claimed in claim 11 wherein the first post is perpendicular to the carrier base.

15. The system as claimed in claim 11 wherein the second post is perpendicular to the carrier base.

16. The system as claimed in claim 11 wherein:
the carrier having the recess includes a recess bottom and a recess slope; and
the second barrier is on the carrier base at the recess bottom.

17. The system as claimed in claim 16 wherein the second post is co-planar with the first post.

18. The system as claimed in claim 16 wherein the carrier base having the recess bottom parallel with the planar surface.

19. The system as claimed in claim 16 wherein the carrier base having the recess slope at an obtuse angle with the recess bottom.

20. The system as claimed in claim 16 wherein the first barrier is an etch protection layer.

Assignees

• Cho Namju
• Chi Heejo
• Shin Hangil
• Stats Chippac Pte Ltd

Inventors

• Cho Namju
• Chi Heejo
• Shin Hangil

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title