Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint

Patent metadata

Field	Value
Publication number	US-9558965-B2
Application number	US-201213403889-A
Country	US
Kind code	B2
Filing date	Feb 23, 2012
Priority date	Jan 29, 2010
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A semiconductor wafer has a plurality of first semiconductor die. A second semiconductor die is mounted to the first semiconductor die. The active surface of the first semiconductor die is oriented toward an active surface of the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die. A portion of a back surface of the second semiconductor die opposite the active surface is removed. Conductive pillars are formed around the second semiconductor die. TSVs can be formed through the first semiconductor die. An interconnect structure is formed over the back surface of the second semiconductor die, encapsulant, and conductive pillars. The interconnect structure is electrically connected to the conductive pillars. A portion of a back surface of the first semiconductor die opposite the active surface is removed. A heat sink or shielding layer can be formed over the back surface of the first semiconductor die.

First claim

What is claimed:

1. A semiconductor device, comprising:
a first semiconductor die including a first thickness during fabrication;
a second semiconductor die including a first thickness during fabrication and an active surface of the second semiconductor die disposed over an active surface of the first semiconductor die;
an encapsulant deposited over the first semiconductor die and second semiconductor die;
a conductive pillar formed through the encapsulant within a footprint of the first semiconductor die;
a build-up interconnect structure including an insulating layer and a redistribution layer each formed directly on the encapsulant and a non-active surface of the second semiconductor die, the redistribution layer of the build-up interconnect structure directly contacting the conductive pillar;
wherein the first semiconductor die includes a second thickness less than the first thickness of the first semiconductor die and the second semiconductor die includes a second thickness less than the first thickness of the second semiconductor die in the semiconductor device; and
a contact pad formed on a non-active surface of the first semiconductor die, the contact pad electrically connected to the conductive pillar and the build-up interconnect structure.

2. The semiconductor device of claim 1 , further including a discrete semiconductor component disposed over the first semiconductor die.

3. The semiconductor device of claim 1 , wherein the conductive pillar includes a post, bump, or microbump.

4. The semiconductor device of claim 1 , further including a heat sink or shielding layer disposed over the first semiconductor die, the shielding layer electrically connected to the contact pad.

5. The semiconductor device of claim 1 , further including an interconnect structure disposed over the contact pad on the non-active surface of the first semiconductor die opposite the active surface of the first semiconductor die.

6. The semiconductor device of claim 1 , further including a third semiconductor die disposed over the first semiconductor die and the non-active surface of the second semiconductor die.

7. A semiconductor device, comprising:
a first semiconductor die;
a second semiconductor die disposed over the first semiconductor die;
an encapsulant deposited over the first semiconductor die and second semiconductor die, the encapsulant coplanar with a non-active surface of the second semiconductor die;
a first interconnect structure formed through the encapsulant and extending to the first semiconductor die; and
a build-up interconnect structure including an insulating layer and a redistribution layer each formed in direct contact with the encapsulant and the non-active surface of the second semiconductor die, the build-up interconnect structure directly contacting the first interconnect structure.

8. The semiconductor device of claim 7 , further including a third semiconductor die disposed over the first semiconductor die.

9. The semiconductor device of claim 7 , further including a discrete semiconductor device disposed over the first semiconductor die.

10. The semiconductor device of claim 7 , further including a third semiconductor die disposed over the first interconnect structure.

11. The semiconductor device of claim 7 , further including a second interconnect structure disposed over a surface of the first semiconductor die opposite an active surface of the first semiconductor die.

12. The semiconductor device of claim 11 , further including the encapsulant deposited around the first and second semiconductor die.

13. The semiconductor device of claim 7 , further including a heat sink or shielding layer disposed over the first semiconductor die.

14. A semiconductor device, comprising:
a first semiconductor die including a contact pad;
a second semiconductor die disposed over the contact pad of the first semiconductor die;
an encapsulant deposited over the first semiconductor die and second semiconductor die, the encapsulant coplanar with a non-active surface of the second semiconductor die;
a first interconnect structure formed through the encapsulant over the first semiconductor die; and
a second interconnect structure including an insulating layer and a conductive layer each formed in direct contact with the encapsulant and second semiconductor die, the conductive layer formed in direct contact with the first interconnect structure.

15. The semiconductor device of claim 14 , further including a third semiconductor die including a fabrication thickness disposed over the first semiconductor die, the third semiconductor die including a reduced thickness relative to the fabrication thickness in the semiconductor device.

16. The semiconductor device of claim 14 , further including a discrete semiconductor device disposed over the first semiconductor die.

17. The semiconductor device of claim 14 , wherein the first interconnect structure includes a conductive pillar, post, bump, or microbump.

18. The semiconductor device of claim 14 , further including a third semiconductor die disposed over the encapsulant.

19. The semiconductor device of claim 14 , further including a third interconnect structure disposed over a surface of the first semiconductor die opposite an active surface of the first semiconductor die.

Assignees

• Chi Heejo
• Cho Namju
• Shin Hangil
• Stats Chippac Pte Ltd

Inventors

• Chi Heejo
• Cho Namju
• Shin Hangil

Classifications

• H10W42/284

  shielding resins · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W72/0198

  batch processes · CPC title