Underbump metallization structure
US-9859235-B2 · Jan 2, 2018 · US
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Jeng Shin-Puu patents
Jeng Shin-Puu holds 16 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 16 |
| Recent patents | 0 |
| First publication | Jan 20, 2015 |
| Latest publication | Jan 2, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Molding wafer chamber
US-9679783-B2 · Jun 13, 2017 · US
Test structure for seal ring quality monitor
US-9601443-B2 · Mar 21, 2017 · US
Bump structure for yield improvement
US-9553053-B2 · Jan 24, 2017 · US
Method of three dimensional integrated circuit assembly
US-9418876-B2 · Aug 16, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Underbump metallization structure
US-9859235-B2 · Jan 2, 2018 · US
Molding wafer chamber
US-9679783-B2 · Jun 13, 2017 · US
Test structure for seal ring quality monitor
US-9601443-B2 · Mar 21, 2017 · US
Bump structure for yield improvement
US-9553053-B2 · Jan 24, 2017 · US
Method of three dimensional integrated circuit assembly
US-9418876-B2 · Aug 16, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W72/072 | 8 |
| H10W90/724 | 8 |
| H01L2924/00 | 8 |
| H01L2924/00014 | 8 |
| H10W72/0198 | 7 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 16 |
| Operations & Transport | 2 |
| Chemistry & Metallurgy | 1 |
| Physics | 1 |