Molding wafer chamber

Patent metadata

Field	Value
Publication number	US-9679783-B2
Application number	US-201113208197-A
Country	US
Kind code	B2
Filing date	Aug 11, 2011
Priority date	Aug 11, 2011
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.

First claim

What is claimed is:

1. A molding system comprising:
a bottom chase with a first shape;
a guiding component mounted in the bottom chase, the guiding component having an outer sidewall and a top surface, the guiding component adapted to hold a molding carrier having a first height in a predetermined location, wherein the guiding component extends above a surface of the bottom chase, the guiding component having a second height smaller than the first height, wherein the second height is measured from the surface of the bottom chase to a surface of the guiding component facing away from the bottom chase, wherein the guiding component is a metal; and
a top component with a second shape, wherein the first shape and the second shape together form a cavity, the cavity having an outer sidewall coterminous with the outer sidewall of the guiding component, wherein the top surface of the guiding component is exposed to the cavity.

2. The molding system of claim 1 , wherein the guiding component is in a fixed position that is within the cavity formed by the top component and the bottom chase.

3. The molding system of claim 1 , wherein the guiding component comprises a guide ring within the bottom chase.

4. The molding system of claim 1 , wherein the guiding component comprises a plurality of guide pins that are movable up and down.

5. The molding system of claim 1 , further comprising a trench within the bottom chase placed outside the guiding component.

6. The molding system of claim 1 , wherein the top component comprises a top chase and a releasing film, wherein the molding system further comprises a releasing component comprising a plurality of tape rollers adjacent to the top chase, the releasing film wound around at least one of the plurality of tape rollers.

7. The molding system of claim 1 , further comprising a releasing component comprising one or more bottom pins within the bottom chase that are movable up and down.

8. The molding system of claim 1 , further comprising a releasing component comprising one or more vacuum holes within the bottom chase.

9. A molding system comprising:
a molding carrier having a first height;
a plurality of semiconductor devices on the molding carrier;
a mold having a bottom component, a top component, and a cavity between the bottom component and the top component;
one or more metal guides disposed within the cavity and located away from sidewalls of the cavity, the one or more metal guides adapted to position the molding carrier within the cavity, wherein the one or more metal guides are adapted to have a second height smaller than the first height; and
an encapsulant on the molding carrier, the encapsulant covering each of the plurality of semiconductor devices, the encapsulant contacting a portion of a sidewall of the molding carrier, the one or more metal guides contacting remaining portions of the sidewall of the molding carrier.

10. The molding system of claim 9 , wherein the one or more metal guides are positioned to overlap the sidewalls of the cavity such that when the top component and the bottom component are joined, the one or more metal guides are retracted.

11. The molding system of claim 9 , wherein the one or more metal guides comprise a guide ring.

12. The molding system of claim 9 , further comprising one or more release pins in the bottom component, the one or more release pins configured to extend, thereby raising the molding carrier.

13. The molding system of claim 9 , wherein the metal guides comprise fixed pins extending into the cavity.

14. The molding system of claim 9 , further comprising one or more vacuum ports in the bottom component.

15. The molding system of claim 9 , wherein the one or more metal guides are in a fixed position that is within the cavity formed by the top component and the bottom component.

16. The molding system of claim 9 , further comprising a trench within the bottom component placed outside the one or more metal guides.

17. The molding system of claim 9 , further comprising a releasing component comprising a plurality of tape rollers adjacent to the top component and a releasing film wound around at least one of the plurality of tape rollers.

18. A molding system comprising:
a bottom component with a first shape;
a top component with a second shape, wherein the first shape and the second shape are configured to form a cavity; and
a metal guiding component mounted in the bottom component, wherein the metal guiding component extends above a surface of the bottom component and has a top surface facing away from the surface of the bottom component, wherein the metal guiding component has an outer sidewall, wherein the metal guiding component is adapted to hold, in a predetermined position of the bottom component, a molding carrier having a top surface separated from the bottom component by a first distance, and wherein the top surface of the metal guiding component is separated from the bottom component by a second distance smaller than the first distance, wherein the cavity has an outer sidewall aligned with the outer sidewall of the metal guiding component and a bottom portion aligned with the top surface of the metal guiding component; and
a first releasing component comprising one or more bottom pins within the bottom component, the first releasing component adapted to move the molding carrier toward the top component.

19. The molding system of claim 18 , wherein the first shape is different from the second shape.

20. The molding system of claim 18 , wherein the metal guiding component is in a fixed position that is within the cavity formed by the top component and the bottom component.

21. The molding system of claim 18 , wherein the metal guiding component comprises a guide ring within the bottom component.

22. The molding system of claim 18 , further comprising a trench within the bottom component placed outside the metal guiding component.

23. The molding system of claim 18 , further comprising a second releasing component comprising a plurality of tape rollers adjacent to the top component and a releasing film wound around at least one of the plurality of tape rollers.

Assignees

• Lin Jing-Cheng
• Chang Chin-Chuan
• Hung Jui-Pin
• Lu Szu Wei
• Jeng Shin-Puu
• Yu Chen-Hua
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lin Jing-Cheng
• Chang Chin-Chuan
• Hung Jui-Pin
• Lu Szu Wei
• Jeng Shin-Puu
• Yu Chen-Hua

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/017

  Auxiliary layers for moulds, e.g. release layers or layers preventing residue · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W74/014 Primary

  using batch processing · CPC title