Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
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Teh Weng Hong patents in 2016
Teh Weng Hong was listed as an assignee on 7 patent publications in 2016.
| Metric | Value |
|---|---|
| Company | Teh Weng Hong |
| Year | 2016 |
| Patents | 7 |
Patents
Representative publications for Teh Weng Hong in 2016.
Device, system and method for providing MEMS structures of a semiconductor package
US-9505610-B2 · Nov 29, 2016 · US
Multi die package having a die and a spacer layer in a recess
US-9490196-B2 · Nov 8, 2016 · US
Inductive inertial sensor architecture and fabrication in packaging build-up layers
US-9429427-B2 · Aug 30, 2016 · US
Bumpless die-package interface for bumpless build-up layer (bbul)
US-2016233166-A1 · Aug 11, 2016 · US
Top CPC classifications
Most common classification codes for Teh Weng Hong in 2016.
| CPC | Patents |
|---|---|
| H10W70/09 | 3 |
| H10W70/60 | 3 |
| H10W70/614 | 3 |
| H10W72/241 | 3 |
| H10W90/00 | 3 |
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