Composition for metal plating comprising suppressing agent for void free submicron feature filling

Patent metadata

Field	Value
Publication number	US-9617647-B2
Application number	US-201013384732-A
Country	US
Kind code	B2
Filing date	Jul 19, 2010
Priority date	Jul 30, 2009
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a polyhydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide.

First claim

The invention claimed is:

1. A composition, comprising a source of copper and an additive obtained by reacting
in a first step
a) a polyhydric alcohol comprising 5 to 6 hydroxyl functional groups
with
b) a first alkylene oxide comprising ethylene oxide and a second alkylene oxide selected from the group consisting of propylene oxide, butylene oxide and a mixture thereof from a mixture comprising the first alkylene oxide and the second alkylene oxide to produce a polyhydric alcohol comprising random copolymer side chains comprising said first alkylene oxide and said second alkylene oxide, and
in a second step
c) functionalizing terminal hydroxyl groups of said random copolymer side chains by reacting in at least one reaction selected from the group consisting of sulfatation and phosphatation.

2. The composition of claim 1 , wherein the polyhydric alcohol is a compound of formula (I):
X(OH) m   (I),

wherein
m is an integer from 5 to 6,
X is an m-valent linear or branched aliphatic or cycloaliphatic radical comprising from 5 to 10 carbon atoms optionally substituted or unsubstituted.

3. The composition of claim 1 , wherein the polyhydric alcohol is a linear or cyclic monosaccharide alcohol represented by formula (II) or (Ill):
HOCH 2 —(CHOH) n —CH 2 OH  (II);

(CHOH) o   (III),

wherein
n is an integer from 3 to 4, and
o is an integer from 5 to 6.

4. The composition of claim 3 , wherein the monosaccharide alcohol is at least one selected from the group consisting of sorbitol, mannitol, xylitol, ribitol, inositol, and derivatives thereof.

5. The composition of claim 1 , wherein the polyhydric alcohol is a monosaccharide of formula (IV) or (V):
CHO—(CHOH) p —CH 2 OH  (IV);

CH 2 OH—(CHOH) q —CO—(CHOH) r —CH 2 OH  (V),

and derivatives thereof,
wherein
p is an integer of 4, and
q and r are integers, and
q+r is 3 or 4.

6. The composition of claim 5 , wherein the monosaccharide is at least one selected from the group consisting of allose, altrose, galactose, glucose, gulose, idose, mannose, talose, glucoheptose, mannoheptose, fructose, psicose, sorbose, tagatose, mannoheptulose, sedoheptulose, taloheptulose, alloheptulose, and derivatives thereof.

7. The composition of claim 1 , wherein the additive is a random copolymer of said first alkylene oxide comprising ethylene oxide and said second alkylene oxide comprising propylene oxide.

8. The composition of claim 1 , wherein a content of the first alkylene oxide in the additive is from 20 to 50% by weight.

9. The composition of claim 1 , wherein a molecular weight, M w , of the additive is 2,000-10000 g/mol.

10. The composition of claim 1 , further comprising an accelerating agent.

11. The composition of claim 1 , further comprising a leveling agent.

12. The composition of claim 1 , wherein a content of the first alkylene oxide in the additive is from 25 to 40% by weight.

13. The composition of claim 1 , wherein a molecular weight M w of the additive is 2,000 to 8000 g/mol.

14. The composition of claim 1 , wherein said additive has a molecular weight M w of from 2,000 to 8,000 g/mol and an average degree of polyoxyalkylation of from about 10 to 500.

15. The composition of claim 1 , wherein said additive has an average degree of polyoxyalkylation of from about 10 to 500.

16. The composition of claim 1 , wherein said additive has a molecular weight M w of from 1,000 to 2,000 g/mol.

17. A metal plating bath, comprising the composition of claim 1 , wherein the bath is suitable for depositing a metal on a substrate comprising features having an aperture size of 30 nanometers or less.

18. A process for depositing a metal layer on a substrate, the process comprising
a) contacting a metal plating bath comprising the composition of claim 1 with a substrate, and
b) applying a current density to the substrate to deposit a metal layer onto the substrate.

19. The process of claim 18 , wherein
the substrate comprises submicrometer-sized features, and
the deposition fills the features.

20. The process of claim 19 , wherein the submicrometer-sized features have an aperture size from 1 to 30 nm, an aspect ratio of 4 or more, or both.

Assignees

• Roeger-Goepfert Cornelia
• Raether Roman Benedikt
• Mayer Dieter
• Haag Alexandra
• Emnet Charlotte
• Basf Se

Inventors

• Roeger-Goepfert Cornelia
• Raether Roman Benedikt
• Mayer Dieter
• Haag Alexandra
• Emnet Charlotte

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• C25D3/02

  from solutions (C25D5/34 - C25D5/46 take precedence) · CPC title

• C25D3/40

  from cyanide baths {, e.g. with Cu+} · CPC title

• C25D3/38 Primary

  of copper · CPC title