Composition for metal electroplating comprising leveling agent

Patent metadata

Field	Value
Publication number	US-9834677-B2
Application number	US-201113634140-A
Country	US
Kind code	B2
Filing date	Mar 17, 2011
Priority date	Mar 18, 2010
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

A composition comprising a source of metal ions and at least one additive comprising a polyalkyleneimine backbone, said polyalkyleneimine backbone having a molecular weight Mw of from 300 g/mol to 1000000 g/mol, wherein the N hydrogen atoms in the backbone are substituted by a polyoxyalkylene radical and wherein the average number of oxyalkylene units in said polyoxyalkylene radical is from 1.5 to 10 per N—H unit.

First claim

The invention claimed is:

1. A composition, comprising:
a metal ion source;
an acidic electrolyte; and
an additive comprising a polyalkyleneimine backbone,
wherein the polyalkyleneimine backbone has a weight average molecular weight M w of from 300 g/mol to 1,000,000 g/mol,
a hydrogen atom bonded to a nitrogen atom in the backbone is substituted by a polyoxyalkylene radical, and
an average number of oxyalkylene units in the polyoxyalkylene radical is from 1.5 to 10 per N—H unit.

2. The composition of claim 1 , wherein the average number of oxyalkylene units in the polyoxyalkylene radical is from 2 to 8 per N—H unit.

3. The composition of claim 1 , wherein the additive is a polyalkyleneimine of formula L1:

or a derivative thereof obtained by a process comprising protonating or quaternizing the polyalkyleneimine,
R is a linear C 2 -C 6 alkanediyl, a branched C 3 -C 6 alkanediyl, or a mixture thereof,
A 1 is a continuation of the polyalkyleneimine backbone by branching,
A 2 is alkyl, alkenyl, alkynyl, alkaryl, or a mixture thereof,
E 1 is a polyoxyalkylene unit of formula —(R 1 O) p R 2 ,
each R 1 is independently ethanediyl, 1,2-propanediyl, (2-hydroxymethyl)ethanediyl, 1,2-butanediyl, 2,3-butanediyl, 2-methyl-1,2-propanediyl (isobutylene), 1-pentanediyl, 2,3-pentanediyl, 2-methyl-1,2-butanediyl, 3-methyl-1,2-butanediyl, 2,3-hexanediyl,3,4-hexanediyl, 2-methyl-1,2-pentanediyl, 2-ethyl-1,2-butanediyl, 3-methyl-1,2-pentanediyl, 1,2-decanediyl, 4-methyl-1,2-pentanediyl, (2-phenyl)ethanediyl, or a mixture thereof,
each R 2 is independently hydrogen, alkyl, alkenyl, alkynyl, alkaryl, aryl, or a mixture thereof,
p is from 1.5 to 10,
q, n, m, and o are non-negative integers and q+n+m+o is from 10 to 24,000.

4. The composition of claim 3 , wherein R is ethanediyl or a combination of ethanediyl and 1,2-propanediyl.

5. The composition of claim 3 , wherein R 1 is ethanediyl or a combination of ethanediyl and 1,2-propanediyl.

6. The composition of claim 3 , wherein R 2 is hydrogen.

7. The composition of claim 3 , wherein p is from 2 to 5.

8. The composition of claim 3 , wherein q+n+m+o is from 15 to 10000.

9. The composition of claim 3 , wherein q+n+m+o is from 25 to 65.

10. The composition of claim 3 , wherein o is 0.

11. The composition of claim 1 , wherein the metal ion source comprises a copper ion.

12. The composition of claim 1 , further comprising an accelerating agent.

13. The composition of claim 1 , further comprising a suppressing agent.

14. A process for depositing a metal layer on a substrate, the process comprising:
contacting a metal plating bath comprising the composition of claim 1 with the substrate, and
applying a current density to the substrate for a time sufficient to deposit the metal layer onto the substrate.

15. A process for depositing a metal layer on a substrate, the process comprising:
contacting a metal plating bath comprising:
a metal ion source;
an acidic electrolyte; and
an additive comprising a polyalkyleneimine backbone,
wherein the polyalkyleneimine backbone has a weight average molecular weight M w of from 300 g/mol to 1,000,000 g/mol,
a hydrogen atom bonded to a nitrogen atom in the backbone is substituted by a polyoxyalkylene radical, and
an average number of oxyalkylene units in the polyoxyalkylene radical is from 1.5 to 10 per N—H unit with the substrate, and
applying a current density to the substrate for a time sufficient to deposit the metal layer onto the substrate,
wherein the substrate comprises a micrometer or submicrometer sized feature and
applying the current density to deposit the metal layer comprises depositing to fill the micrometer or submicrometer sized feature.

16. The process of claim 15 , wherein the micrometer or submicrometer-sized feature has a size from 1 to 1000 nm, an aspect ratio of 4 or more, or both.

17. The composition of claim 7 , wherein p is from 2 to 3.

18. The composition of claim 8 , wherein q+n+m+o is from 20 to 5000.

19. The composition of claim 3 , wherein q+n+m+o is from 1000 to 1800.

20. The process of claim 14 ,
wherein the additive is a polyalkyleneimine of formula L1:

or a derivative thereof obtained by a process comprising protonating or quaternzing the polyalkyleneimine,
each R is independently a linear C 2 -C 6 alkanediyl, a branched C 3 -C 6 alkanediyl, or a mixture thereof,
A 1 is a continuation of the polyalkyleneimine backbone by branching,
each A 2 is independently alkyl, alkenyl, alkynyl, alkaryl, or a mixture thereof,
E 1 is a polyoxyalkylene unit of formula —(R 1 O) p R 2 ,
each R 1 is independently ethanediyl, 1,2-propanediyl, (2-hydroxymethyl)ethanediyl, 1,2-butanediyl, 2,3-butanediyl, 2-methyl-1,2-propanediyl (isobutylene), 1-pentanediyl, 2,3-pentanediyl, 2-methyl-1,2-butanediyl, 3-methyl-1,2-butanediyl, 2,3-hexanediyl, 3,4-hexanediyl, 2-methyl-1,2-pentanediyl, 2-ethyl-1,2-butanediyl, 3-methyl-1,2-pentanediyl, 1,2-decanediyl, 4-methyl-1,2-pentanediyl and (2-phenyl)ethanediyl, or a mixture thereof,
each R 2 is independently hydrogen, alkyl, alkenyl, alkynyl, alkaryl, aryl, or a mixture thereof,
p is from 1.5 to 10,
q, n, m, o are non-negative integers and a sum q+n+m+o is from 10 to 24,000.

21. The composition of claim 1 , wherein said acidic electrolyte is at least one acidic electrolyte selected from the group consisting of sulfuric acid, acetic acid, fluoroboric acid, methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, trifluoromethane sulfonic acid, phenyl sulfonic acid, toluenesulfonic acid, sulfamic acid, hydrochloric acid and phosphoric acid.

22. The composition of claim 1 , wherein said acidic electrolyte is present in an amount of 1 to 300 g/L.

23. The composition according to claim 1 , wherein said polyalkyleneimine backbone has a weight average molecular weight Mw of from 600 g/mol to 1,000,000 g/mol.

24. The composition according to claim 1 , wherein said polyalkyleneimine backbone has a weight average molecular weight Mw of from 1,000 g/mol to 1,000,000 g/mol.

25. The composition according to claim 3 , where o is 0.

26. The process according to claim 20 , where o is 0.

27. The composition according to claim 3 , where A 2 is an alkyl which is methyl.

28. The process according to claim 20 , where A 2 is an alkyl which is methyl.

Assignees

• Roeger-Goepfert Cornelia
• Raether Roman Benedikt
• Arnold Marco
• Emnet Charlotte
• Mayer Dieter
• Basf Se

Inventors

• Roeger-Goepfert Cornelia
• Raether Roman Benedikt
• Arnold Marco
• Emnet Charlotte
• Mayer Dieter

Classifications

• C25D3/38

  of copper · CPC title

• C25D3/30

  of tin · CPC title

• C23C18/31

  Coating with metals · CPC title

• C08G73/0206

  Polyalkylene(poly)amines · CPC title

• C08L79/02 Primary

  Polyamines · CPC title