Semiconductor package structure and manufacturing method thereof
US-11798909-B2 · Oct 24, 2023 · US
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Phoenix Pioneer Technology Co Ltd patents in 2023
Phoenix Pioneer Technology Co Ltd was listed as an assignee on 13 patent publications in 2023.
| Metric | Value |
|---|---|
| Company | Phoenix Pioneer Technology Co Ltd |
| Year | 2023 |
| Patents | 13 |
Patents
Representative publications for Phoenix Pioneer Technology Co Ltd in 2023.
Package substrate and method for manufacturing the same
US-11791281-B2 · Oct 17, 2023 · US
Manufacturing method for surface acoustic wave filter package structure
US-11757426-B2 · Sep 12, 2023 · US
Semiconductor package device
US-11749612-B2 · Sep 5, 2023 · US
Electronic package and manufacturing method thereof
US-2023187402-A1 · Jun 15, 2023 · US
Top CPC classifications
Most common classification codes for Phoenix Pioneer Technology Co Ltd in 2023.
| CPC | Patents |
|---|---|
| H10W70/65 | 7 |
| H10W70/685 | 7 |
| H10W90/701 | 7 |
| H10W70/093 | 6 |
| H10W90/724 | 6 |
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