Method for fabricating bump structures on chips with panel type process
US-10483232-B2 · Nov 19, 2019 · US
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Phoenix Pioneer Technology Co Ltd patents in 2019
Phoenix Pioneer Technology Co Ltd was listed as an assignee on 15 patent publications in 2019.
| Metric | Value |
|---|---|
| Company | Phoenix Pioneer Technology Co Ltd |
| Year | 2019 |
| Patents | 15 |
Patents
Representative publications for Phoenix Pioneer Technology Co Ltd in 2019.
Interposer substrate and method of fabricating the same
US-10483194-B2 · Nov 19, 2019 · US
Flip-chip packaging substrate and method for fabricating the same
US-2019348375-A1 · Nov 14, 2019 · US
Interposer substrate and method for manufacturing the same
US-10475765-B2 · Nov 12, 2019 · US
Semiconductor package structure and method of making the same
US-10475752-B2 · Nov 12, 2019 · US
Top CPC classifications
Most common classification codes for Phoenix Pioneer Technology Co Ltd in 2019.
| CPC | Patents |
|---|---|
| H10W70/05 | 9 |
| H10W74/00 | 9 |
| H01L2924/181 | 8 |
| H10W90/701 | 8 |
| H10W70/635 | 7 |
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