Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-9988573-B2 · Jun 5, 2018 · US
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Iwano Tomohiro patents
Iwano Tomohiro holds 6 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 6 |
| Recent patents | 0 |
| First publication | May 26, 2015 |
| Latest publication | Jun 5, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same
US-9982177-B2 · May 29, 2018 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-9881802-B2 · Jan 30, 2018 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-9881801-B2 · Jan 30, 2018 · US
CMP polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material
US-9447306-B2 · Sep 20, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-9988573-B2 · Jun 5, 2018 · US
Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same
US-9982177-B2 · May 29, 2018 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-9881802-B2 · Jan 30, 2018 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-9881801-B2 · Jan 30, 2018 · US
CMP polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material
US-9447306-B2 · Sep 20, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10P95/062 | 6 |
| C09K3/1463 | 6 |
| C09G1/02 | 6 |
| H01L21/31053 | 6 |
| C09K3/14 | 6 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Chemistry & Metallurgy | 6 |
| Electricity | 6 |
| Operations & Transport | 5 |